H05K 2201/09818
Shape or layout details not covered by a single group of h05k2201/09009
Official title: Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
H05K2201/09818 (Shape or layout details not covered by a single group of h05k2201/09009) appears on 5,196 US grants and 5,662 published applications in this corpus.
Search patents in H05K- Granted patents
- 5,196
- Published applications
- 5,662
- Assignees
- 1,702
- Inventors
- 11,384
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 4 | 0 |
| 1978 | 10 | 0 |
| 1979 | 4 | 0 |
| 1980 | 13 | 0 |
| 1981 | 10 | 0 |
| 1982 | 7 | 0 |
| 1983 | 13 | 0 |
| 1984 | 12 | 0 |
| 1985 | 19 | 0 |
| 1986 | 24 | 0 |
| 1987 | 25 | 0 |
| 1988 | 23 | 0 |
| 1989 | 37 | 0 |
| 1990 | 48 | 0 |
| 1991 | 48 | 0 |
| 1992 | 41 | 0 |
| 1993 | 48 | 0 |
| 1994 | 54 | 0 |
| 1995 | 67 | 0 |
| 1996 | 60 | 0 |
| 1997 | 64 | 0 |
| 1998 | 70 | 0 |
| 1999 | 73 | 0 |
| 2000 | 83 | 0 |
| 2001 | 112 | 58 |
| 2002 | 129 | 138 |
| 2003 | 143 | 179 |
| 2004 | 132 | 174 |
| 2005 | 112 | 283 |
| 2006 | 154 | 298 |
| 2007 | 157 | 292 |
| 2008 | 176 | 312 |
| 2009 | 144 | 334 |
| 2010 | 205 | 279 |
| 2011 | 220 | 215 |
| 2012 | 223 | 217 |
| 2013 | 186 | 197 |
| 2014 | 176 | 237 |
| 2015 | 194 | 295 |
| 2016 | 211 | 197 |
| 2017 | 202 | 199 |
| 2018 | 189 | 190 |
| 2019 | 207 | 189 |
| 2020 | 206 | 222 |
| 2021 | 155 | 200 |
| 2022 | 166 | 196 |
| 2023 | 156 | 199 |
| 2024 | 144 | 185 |
| 2025 | 153 | 159 |
| 2026 | 83 | 218 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/09845Stepped hole, via, edge, bump or conductorIndexing code727
- H05K 2201/09827TaperedIndexing code664
- H05K 2201/09918Optically detected marks used for aligning tool relative to the pcbIndexing code515
- H05K 2201/09909Special local insulating patternIndexing code507
- H05K 2201/0989Coating free areasIndexing code429
- H05K 2201/09972PartitionedIndexing code422
- H05K 2201/099Coating over padsIndexing code417
- H05K 2201/09854Hole or via having special cross-sectionIndexing code355
All 20 subgroupsShow fewer
- H05K 2201/0999Circuit printed on or in housingIndexing code339
- H05K 2201/09954More mounting possibilitiesIndexing code291
- H05K 2201/09981Metallised wallsIndexing code271
- H05K 2201/09881Coating only between conductors, i.e. flush with the conductorsIndexing code270
- H05K 2201/09936Marks, inscriptions, etc. for informationIndexing code202
- H05K 2201/09872Insulating conformal coatingIndexing code173
- H05K 2201/09945Universal aspectsIndexing code97
- H05K 2201/09836Oblique hole, via or bumpIndexing code92
- H05K 2201/09863Concave hole or viaIndexing code76
- H05K 2201/09927Machine readable codeIndexing code70
- H05K 2201/09963Programming circuit by using small elementsIndexing code29
- H05K 2201/09985Hollow waveguide combined with printed circuitIndexing code18
Recent patents
- Circuit board structure and manufacturing method thereof6 Oct 2026US 12,757,334 B2Unimicron Technology Corp.
- Circuit board and manufacturing method thereof29 Sep 2026US 12,750,953 B2Samsung Electro-Mechanics Co., Ltd.
- Structural enclosure for protection against foreign object debris and restraint of thermal interface material15 Sep 2026US 12,739,978 B2Raytheon Company
- Printed circuit board8 Sep 2026US 12,733,094 B2Samsung Electro-Mechanics Co., Ltd.
- Printed circuit board1 Sep 2026US 12,727,088 B2Samsung Electro-Mechanics Co., Ltd.
- Signal transmission structure for signal transmission in multi-layer circuit board and electronic device including the same8 Oct 2026US 2026/0312270 A1Samsung Electronics Co., Ltd.
- Circuit board and semiconductor package comprising same8 Oct 2026US 2026/0313791 A1LG Innotek Co., Ltd.
- Printed circuit board8 Oct 2026US 2026/0313794 A1Samsung Electro-Mechanics Co., Ltd.
- Electronic device with multi-diameter female contacts and related methods1 Oct 2026US 2026/0304640 A1Eagle Technology, LLC
- Circuit board device24 Sep 2026US 2026/0292971 A1Global Unichip Corporation
Most cited
By later US patents
- Method and apparatus for 3D interconnect542US 8,076,237 B2ASM America, Inc. · 2011
- BGA component masking dam and a method of manufacturing with the BGA component masking dam353US 11,172,580 B2Rosemount Aerospace Inc. · 2021
- Semiconductor device having dual electrical contact sites344US 5,157,480 AMotorola, Inc. · 1992
- Method for fabricating semiconductor components using focused laser beam321US 6,114,240 AMicron Technology, Inc. · 2000
- Multilayer circuit board manufacturing278US 4,642,160 AInterconnect Technology Inc. · 1987