H05K 2201/09945
Universal aspects
Official title: Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
H05K2201/09945 (Universal aspects) appears on 97 US grants and 54 published applications in this corpus.
Search patents in H05K- Granted patents
- 97
- Published applications
- 54
- Assignees
- 63
- Inventors
- 192
- Latest grant
- 25 Nov 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 5 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 9 | 0 |
| 1997 | 6 | 0 |
| 1998 | 0 | 0 |
| 1999 | 6 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 1 |
| 2002 | 1 | 0 |
| 2003 | 0 | 6 |
| 2004 | 2 | 1 |
| 2005 | 1 | 1 |
| 2006 | 0 | 2 |
| 2007 | 0 | 2 |
| 2008 | 1 | 0 |
| 2009 | 1 | 2 |
| 2010 | 1 | 2 |
| 2011 | 0 | 6 |
| 2012 | 3 | 0 |
| 2013 | 1 | 0 |
| 2014 | 1 | 2 |
| 2015 | 1 | 0 |
| 2016 | 1 | 2 |
| 2017 | 2 | 5 |
| 2018 | 4 | 6 |
| 2019 | 7 | 6 |
| 2020 | 5 | 2 |
| 2021 | 2 | 4 |
| 2022 | 0 | 1 |
| 2023 | 4 | 2 |
| 2024 | 0 | 1 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Probe card device25 Nov 2025US 12,480,973 B2Princo Corp.
- Display device14 Nov 2023US 11,817,019 B2Samsung Display Co., Ltd.
- Manufacturing method of anisotropic conductive film and apparatus thereof22 Aug 2023US 11,735,333 B2Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Electronic device including structure for stacking substrates4 Jul 2023US 11,696,404 B2Samsung Electronics Co., Ltd.
- Electrical connector and method for producing same25 Apr 2023US 11,637,406 B2Shin-Etsu Polymer Co., Ltd.
- Self-guiding electric connector14 Nov 2024US 2024/0380144 A1
- Probe card device14 Sep 2023US 2023/0288450 A1Princo Corp.
- Interposer and substrate module6 Apr 2023US 2023/0105252 A1Murata Manufacturing Co., Ltd.
- Interposer For Printed Circuit Boards31 Mar 2022US 2022/0104361 A1Softiron Limited
- Manufacturing method of anisotropic conductive film and apparatus thereof21 Oct 2021US 2021/0327607 A1Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
Most cited
By later US patents
- Electrically conductive adhesive connecting arrays of conductors165US 4,113,981 ASeikosha Co., Ltd. · 1978
- Multi-layer circuit construction methods with customization features158US 5,282,312 ATessera, Inc. · 1994
- Electrically and thermally conductive adhesive transfer tape128US 4,606,962 AMinnesota Mining and Manufacturing Company · 1986
- Circuit boards containing vias and methods for producing same112US 6,797,616 B2Micron Technology, Inc. · 2004
- Circuit boards containing vias and methods for producing same111US 6,774,486 B2Micron Technology, Inc. · 2004