Interposer For Printed Circuit Boards

A method of assembling elements in a socket cavity, the method comprising:

• positioning a bottom printed circuit (PCB) including an array of contact pads;
• positioning at least one interposer above the bottom PCB, wherein the at least one interposer comprises:
• an array of top connectors configured to contact the array of contact pads of the top PCB;
• an array of bottom connectors configured to contact the array of contact pads of the bottom PCB;
• and
• interconnections configured to electrically connect the top connectors and the bottom connectors;
• positioning at least one spacer element above the bottom PCB;
• positioning a top PCB, including an array of contact pads, above the at least one spacer element;
• and
• fastening the top PCB and the bottom PCB so that the at least one spacer element maintains a specified distance of separation between the top and bottom PCBs.

A socket cavity configured to engage with a top printed circuit board (PCB) and a bottom PCB, each of the PCBs including an array of contact pads, the socket cavity comprising:

• an array of top spring connectors configured to contact the array of contact pads of the top PCB;
• an array of bottom spring connectors configured to contact the array of contact pads of the bottom PCB;
• and
• interconnections configured to electrically connect the top connectors and the bottom connectors;
• and
• at least one spacer element positioned between the top PCB and the bottom PCB and configured to contribute to maintaining a specified distance between the top PCB and the bottom PCB.