H05K 2201/09
Shape and layout
H05K2201/09 (Shape and layout) appears on 23,225 US grants and 24,098 published applications in this corpus.
Search patents in H05K- Granted patents
- 23,225
- Published applications
- 24,098
- Assignees
- 4,822
- Inventors
- 39,228
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 31 | 0 |
| 1977 | 31 | 0 |
| 1978 | 41 | 0 |
| 1979 | 18 | 0 |
| 1980 | 40 | 0 |
| 1981 | 46 | 0 |
| 1982 | 51 | 0 |
| 1983 | 55 | 0 |
| 1984 | 51 | 0 |
| 1985 | 101 | 0 |
| 1986 | 93 | 0 |
| 1987 | 119 | 0 |
| 1988 | 104 | 0 |
| 1989 | 151 | 0 |
| 1990 | 160 | 0 |
| 1991 | 193 | 0 |
| 1992 | 184 | 0 |
| 1993 | 201 | 0 |
| 1994 | 205 | 0 |
| 1995 | 274 | 0 |
| 1996 | 248 | 0 |
| 1997 | 237 | 0 |
| 1998 | 336 | 0 |
| 1999 | 336 | 0 |
| 2000 | 412 | 0 |
| 2001 | 527 | 251 |
| 2002 | 605 | 628 |
| 2003 | 607 | 754 |
| 2004 | 666 | 903 |
| 2005 | 543 | 1065 |
| 2006 | 694 | 1156 |
| 2007 | 722 | 1228 |
| 2008 | 746 | 1395 |
| 2009 | 667 | 1346 |
| 2010 | 889 | 1140 |
| 2011 | 921 | 933 |
| 2012 | 951 | 836 |
| 2013 | 774 | 809 |
| 2014 | 693 | 1044 |
| 2015 | 801 | 1054 |
| 2016 | 870 | 884 |
| 2017 | 927 | 824 |
| 2018 | 821 | 857 |
| 2019 | 927 | 920 |
| 2020 | 903 | 1039 |
| 2021 | 767 | 986 |
| 2022 | 855 | 939 |
| 2023 | 733 | 969 |
| 2024 | 752 | 808 |
| 2025 | 726 | 680 |
| 2026 | 420 | 650 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Circuit board and electronic device6 Oct 2026US 12,757,322 B2Shenzhen Jufei Optoelectronics Co., Ltd.
- Wiring board, electronic component storage package, and electronic device6 Oct 2026US 12,757,324 B2KYOCERA Corporation
- Buried skip vias for improved signal and power integrity6 Oct 2026US 12,757,327 B2NVIDIA Corporation
- Lens module with multi-layer bent circuit board and electronic device having the same6 Oct 2026US 12,757,330 B2Triple Win Technology(Shenzhen) Co. Ltd.
- Flexible printed circuit to suspension soldering improvement6 Oct 2026US 12,757,332 B2Western Digital Technologies, Inc.
- Signal transmission structure for signal transmission in multi-layer circuit board and electronic device including the same8 Oct 2026US 2026/0312270 A1Samsung Electronics Co., Ltd.
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Printed circuit board8 Oct 2026US 2026/0313787 A1Samsung Electro-Mechanics Co., Ltd.
- Circuit board and semiconductor package comprising same8 Oct 2026US 2026/0313791 A1LG Innotek Co., Ltd.
- Printed circuit board8 Oct 2026US 2026/0313794 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Ceramic emitter substrate831US 8,355,766 B2Masimo Corporation · 2013
- Method and apparatus for 3D interconnect542US 8,076,237 B2ASM America, Inc. · 2011
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- LED lamp assembly with means to conduct heat away from the LEDS470US 6,045,240 ARelume Corporation · 2000
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999