Buried skip vias for improved signal and power integrity

A device comprising:

• a first exterior section of a printed circuit board (PCB), the first exterior section of the PCB comprising at least three conductive layers including a first outermost conductive layer of the PCB;
• a second exterior section of the PCB, the second exterior section of the PCB comprising at least three conductive layers including a second outermost conductive layer of the PCB;
• and
• an interior section of the PCB, disposed between the first exterior section of the PCB and the second exterior section of the PCB, comprising a first interior conductive layer corresponding to a first end of the interior section, a second interior conductive layer corresponding to a second end of the interior section opposite the first end, a third interior conductive layer disposed between the first interior conductive layer and the second interior conductive layer, a fourth interior conductive layer disposed between the first interior conductive layer and the second interior conductive layer, a fifth interior conductive layer disposed between the first interior conductive layer and the third interior conductive layer, and a sixth interior conductive layer disposed between the second interior conductive layer and the fourth interior conductive layer;
• wherein the first exterior section of the PCB further comprises a first set of vias comprising at least three vertically arranged vias, the first set of vias extending from the first outermost conductive layer to the first interior conductive layer;
• wherein the second exterior section of the PCB further comprises a second set of vias comprising at least three vertically arranged vias, the second set of vias extending from the second outermost conductive layer to the second interior conductive layer;
• and
• wherein the interior section of the PCB further comprises:
• buried skip vias each corresponding to a via having ends connected to respective interior conductive layers of the interior section of the PCB that are separated by at least one layer of the interior section of the PCB, wherein the buried skip vias comprise a first buried skip via extending from the first interior conductive layer to the third interior conductive layer and bypassing the fifth interior conductive layer, and a second buried skip via extending from the second interior conductive layer to the fourth interior conductive layer and bypassing the sixth interior conductive layer;
• an additional buried via that spans the interior section by extending from the first interior conductive layer to the second interior conductive layer;
• a first additional via directly underneath the first set of vias and having an end connected to the fifth interior conductive layer;
• and
• a second additional via directly underneath the second set of vias and having an end connected to the sixth interior conductive layer.