H05K 2201/09145
Edge details
H05K2201/09145 (Edge details) appears on 1,601 US grants and 1,507 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,601
- Published applications
- 1,507
- Assignees
- 777
- Inventors
- 3,715
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 2 | 0 |
| 1978 | 6 | 0 |
| 1979 | 0 | 0 |
| 1980 | 7 | 0 |
| 1981 | 9 | 0 |
| 1982 | 8 | 0 |
| 1983 | 7 | 0 |
| 1984 | 4 | 0 |
| 1985 | 12 | 0 |
| 1986 | 9 | 0 |
| 1987 | 12 | 0 |
| 1988 | 8 | 0 |
| 1989 | 11 | 0 |
| 1990 | 26 | 0 |
| 1991 | 17 | 0 |
| 1992 | 13 | 0 |
| 1993 | 9 | 0 |
| 1994 | 8 | 0 |
| 1995 | 11 | 0 |
| 1996 | 22 | 0 |
| 1997 | 26 | 0 |
| 1998 | 23 | 0 |
| 1999 | 23 | 0 |
| 2000 | 41 | 0 |
| 2001 | 22 | 12 |
| 2002 | 53 | 36 |
| 2003 | 35 | 43 |
| 2004 | 42 | 55 |
| 2005 | 28 | 59 |
| 2006 | 39 | 79 |
| 2007 | 53 | 76 |
| 2008 | 47 | 78 |
| 2009 | 46 | 62 |
| 2010 | 55 | 66 |
| 2011 | 46 | 59 |
| 2012 | 58 | 52 |
| 2013 | 41 | 52 |
| 2014 | 46 | 71 |
| 2015 | 64 | 94 |
| 2016 | 60 | 62 |
| 2017 | 79 | 46 |
| 2018 | 57 | 51 |
| 2019 | 58 | 75 |
| 2020 | 75 | 77 |
| 2021 | 56 | 71 |
| 2022 | 68 | 54 |
| 2023 | 41 | 51 |
| 2024 | 51 | 62 |
| 2025 | 48 | 29 |
| 2026 | 15 | 35 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/09181Notches in edge padsIndexing code430
- H05K 2201/0919Exposing inner circuit layers or metal planes at the side edge ofIndexing code329
- H05K 2201/09154Bevelled, chamferred or tapered edgeIndexing code236
- H05K 2201/09163Slotted edgeIndexing code169
- H05K 2201/09172Notches between edge padsIndexing code168
- H05K 2201/092Exposing inner circuit layers or metal planes at the walls of highIndexing code43
Recent patents
- Substrate11 Aug 2026US 12,708,003 B2Infineon Technologies AG
- Wiring board and manufacturing method therefor28 Jul 2026US 12,696,385 B2Toppan Holdings Inc.
- Data throughput using a metal bracket21 Jul 2026US 12,690,172 B2Micron Technology, Inc.
- Latching system for establishing a latching connection between a printed circuit board and an edge-contact plug, printed circuit board, edge- contact plug and add-on part7 Jul 2026US 12,677,379 B2Hella GmbH & Co. KGaA
- Sensor interposer employing castellated through-vias30 Jun 2026US 12,672,235 B2DexCom, Inc.
- Data throughput using a metal bracket8 Oct 2026US 2026/0313848 A1Micron Technology, Inc.
- Base member, electronic device, and structure17 Sep 2026US 2026/0282217 A1Canon Kabushiki Kaisha
- Sensor interposer employing castellated through-vias17 Sep 2026US 2026/0282225 A1DexCom, Inc.
- Camera module and electronic device comprising same17 Sep 2026US 2026/0282235 A1Samsung Electronics Co., Ltd.
- Magnetic component and power conversion module20 Aug 2026US 2026/0246374 A1Lite-On Technology Corporation
Most cited
By later US patents
- Ceramic emitter substrate831US 8,355,766 B2Masimo Corporation · 2013
- Plated plastic castellated interconnect for electrical components301US 5,069,626 AWestern Digital Corporation · 1991
- Unmanned aerial vehicle apparatus, system and method for retrieving data228US 6,868,314 B12005
- Methods for assembling multiple semiconductor devices202US 7,198,980 B2Micron Technology, Inc. · 2007
- Method for making printed circuit boards with selectivity filled plated through holes200US 5,487,218 AInternational Business Machines Corporation · 1996