H05K 2201/092
Exposing inner circuit layers or metal planes at the walls of high
Official title: Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes
H05K2201/092 (Exposing inner circuit layers or metal planes at the walls of high) appears on 43 US grants and 34 published applications in this corpus.
Search patents in H05K- Granted patents
- 43
- Published applications
- 34
- Assignees
- 30
- Inventors
- 102
- Latest grant
- 12 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 1 | 0 |
| 2005 | 1 | 3 |
| 2006 | 0 | 2 |
| 2007 | 3 | 3 |
| 2008 | 0 | 2 |
| 2009 | 1 | 0 |
| 2010 | 1 | 2 |
| 2011 | 0 | 5 |
| 2012 | 2 | 3 |
| 2013 | 2 | 1 |
| 2014 | 4 | 0 |
| 2015 | 1 | 0 |
| 2016 | 0 | 0 |
| 2017 | 1 | 2 |
| 2018 | 0 | 1 |
| 2019 | 2 | 1 |
| 2020 | 2 | 2 |
| 2021 | 1 | 0 |
| 2022 | 1 | 2 |
| 2023 | 1 | 1 |
| 2024 | 0 | 1 |
| 2025 | 1 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Low PIM coax to PCB interface and method of constructing the same12 Aug 2025US 12,388,201 B2Telefonaktiebolaget LM Ericsson (publ)
- Module substrate and semiconductor module including the same17 Oct 2023US 11,792,921 B2Samsung Electronics Co., Ltd.
- Module substrate and semiconductor module including the same1 Nov 2022US 11,490,509 B2Samsung Electronics Co., Ltd.
- Circuit board, method for manufacturing circuit board, and electronic device19 Jan 2021US 10,896,871 B2Fujitsu Limited
- Integrated circuit chip packaging including a heat sink topped cavity27 Oct 2020US 10,818,572 B2International Business Machines Corporation
- Led module having through channels and conforming to certification standards of dci and display screen18 Jun 2026US 2026/0173590 A1Nanjing Lopu Co., Ltd.
- Rigid-flexible pcb, power module including the pcb, and manufacturing method of the power module29 May 2025US 2025/0176113 A1STMicroelectronics International N. V.
- Printed circuit board grounding13 Jun 2024US 2024/0196516 A1AES Global Holdings PTE Ltd.
- Low pim coax to pcb interface23 Feb 2023US 2023/0058023 A1Telefonaktiebolaget LM Ericsson (publ)
- Module substrate and semiconductor module including the same29 Dec 2022US 2022/0418097 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Method for making printed circuit boards with selectivity filled plated through holes200US 5,487,218 AInternational Business Machines Corporation · 1996
- Manufacturing circuit board assemblies having filled vias171US 5,822,856 AInternational Business Machines Corporation · 1998
- Multilayer circuit board construction and method112US 4,211,603 ATektronix, Inc. · 1980
- High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer105US 6,323,436 B1International Business Machines Corporation · 2001
- Method of preparing a printed circuit board104US 5,557,844 AInternational Business Machines Corporation · 1996