Rigid-flexible pcb, power module including the pcb, and manufacturing method of the power module

A method of manufacturing a power module, the power module including a rigid substrate including conductive material;

• a PCB having a first PCB region having a stacked structure of piled up layers or films along a first direction;
• a second PCB region having the stacked structure locally delimited at a first side by a top stiffening element and at a second side, opposite to the first side along the first direction, by a bottom stiffening element;
• and a third PCB region comprising the stacked structure, wherein the first PCB region is electrically coupled between the rigid substrate and a first end of the second PCB region, and the third PCB region is electrically coupled to a second end, opposite to the first end, of the second PCB region, and wherein the top and bottom stiffening elements are configured to locally increase the rigidity of the PCB with respect to the first and third regions of the PCB where the top and bottom stiffening elements are absent, the method, comprising:
• providing a mold having a base element and a cap element, one among the base element and the cap element including a passing hole, the base element and the cap element being shaped such as to define a first inner chamber, a second inner chamber and a restriction region, including a first protrusion from the base element and a second protrusion from the cap element, between the first inner chamber and the second inner chamber;
• arranging the power module on a supporting portion within the base element, in such a way that the top stiffening element is in correspondence of the first protrusion and the bottom stiffening element is in correspondence of the second protrusion;
• coupling together the base element and the cap element, applying a pressure on the top and bottom stiffening elements through the first and second protrusions;
• injecting a resin within the first inner chamber through the passing hole;
• solidifying the resin within the first inner chamber;
• and
• removing the mold.

A PCB, comprising:

• a first PCB region;
• a second PCB region;
• a third PCB region, wherein the first, second, and third PCB regions extend with physical and electrical continuity with one another;
• and
• a stacked structure including a plurality of piled-up layers along a first direction, wherein each of the first and second PCB regions includes the stacked structure, and
• wherein the third PCB region includes the stacked structure, a top stiffening element on a first side of the stacked structure, and a bottom stiffening element on a second side, opposite to the first side along the first direction, of the stacked structure,
• the top and bottom stiffening elements configured to locally increase a rigidity of the PCB at the third PCB region.