H05K 2201/00
Indexing scheme relating to printed circuits covered by h05k1/00
Official title: Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/00 (Indexing scheme relating to printed circuits covered by h05k1/00) appears on 51,668 US grants and 55,326 published applications in this corpus.
Search patents in H05K- Granted patents
- 51,668
- Published applications
- 55,326
- Assignees
- 9,254
- Inventors
- 82,094
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 95 | 0 |
| 1977 | 90 | 0 |
| 1978 | 105 | 0 |
| 1979 | 60 | 0 |
| 1980 | 98 | 0 |
| 1981 | 108 | 0 |
| 1982 | 128 | 0 |
| 1983 | 156 | 0 |
| 1984 | 172 | 0 |
| 1985 | 227 | 0 |
| 1986 | 231 | 0 |
| 1987 | 288 | 0 |
| 1988 | 281 | 0 |
| 1989 | 367 | 0 |
| 1990 | 373 | 0 |
| 1991 | 427 | 0 |
| 1992 | 442 | 0 |
| 1993 | 430 | 0 |
| 1994 | 492 | 0 |
| 1995 | 536 | 0 |
| 1996 | 482 | 0 |
| 1997 | 489 | 0 |
| 1998 | 675 | 0 |
| 1999 | 734 | 0 |
| 2000 | 786 | 0 |
| 2001 | 997 | 464 |
| 2002 | 1124 | 1248 |
| 2003 | 1133 | 1369 |
| 2004 | 1191 | 1746 |
| 2005 | 1043 | 2004 |
| 2006 | 1223 | 2189 |
| 2007 | 1310 | 2332 |
| 2008 | 1267 | 2502 |
| 2009 | 1319 | 2687 |
| 2010 | 1617 | 2336 |
| 2011 | 1706 | 1922 |
| 2012 | 1850 | 1818 |
| 2013 | 1538 | 1871 |
| 2014 | 1465 | 2350 |
| 2015 | 1691 | 2595 |
| 2016 | 1979 | 2262 |
| 2017 | 2224 | 2268 |
| 2018 | 2149 | 2489 |
| 2019 | 2513 | 2668 |
| 2020 | 2498 | 2876 |
| 2021 | 2238 | 2613 |
| 2022 | 2137 | 2532 |
| 2023 | 2014 | 2443 |
| 2024 | 2030 | 2277 |
| 2025 | 1979 | 1888 |
| 2026 | 1161 | 1577 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/10Details of components or other objects attached to or integrated in aIndexing code30,291
- H05K 2201/09Shape and layoutIndexing code23,225
- H05K 2201/03Conductive materialsIndexing code8,281
- H05K 2201/01DielectricsIndexing code7,776
- H05K 2201/02FillersIndexing code4,031
- H05K 2201/20Details of printed circuits not provided for in h05k2201/01 - h05k2201/10Indexing code3,204
- H05K 2201/04Assemblies of printed circuitsIndexing code2,846
- H05K 2201/06Thermal detailsIndexing code2,483
Recent patents
- Double layered electrolytic copper foil and manufacturing method thereof6 Oct 2026US 12,753,524 B2Volta Energy Solutions S.A.R.L.
- Printed circuit board to dielectric waveguide interface6 Oct 2026US 12,756,084 B1Northrop Grumman Systems Corporation
- Ground connection for automotive shielded cables6 Oct 2026US 12,756,119 B1Infineon Technologies Americas Corp.
- Organic substrate for placing components of a camera6 Oct 2026US 12,756,912 B1Apple Inc.
- Low-profile fasteners with springs for heat transfer device loading6 Oct 2026US 12,757,316 B2Intel Corporation
- Organic fiber fabric and uses of the same8 Oct 2026US 2026/0308839 A1
- Display device8 Oct 2026US 2026/0310021 A1Wuhan China Star Optoelectronics Technology Co., Ltd.
- Electronic device8 Oct 2026US 2026/0311925 A1Denso Corporation
- Signal transmission structure for signal transmission in multi-layer circuit board and electronic device including the same8 Oct 2026US 2026/0312270 A1Samsung Electronics Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0312273 A1Amkor Technology Singapore Holding Pte.Ltd.
Most cited
By later US patents
- Programmer1,483US 4,213,562 A1980
- Oximeter sensor assembly with integral cable1,236US 4,964,408 AThor Technology Corporation · 1990
- Oximeter sensor assembly with integral cable and encoder1,015US 5,069,213 AThor Technology Corporation · 1991
- Oximeter sensor assembly with integral cable and method of forming the same965US 5,041,187 AThor Technology Corporation · 1991
- Flex circuit connector916US 5,482,473 AMiniMed Inc. · 1996