H05K 2201/02
Fillers
Official title: Fillers; Particles; Fibers; Reinforcement materials
H05K2201/02 (Fillers) appears on 4,031 US grants and 4,618 published applications in this corpus.
Search patents in H05K- Granted patents
- 4,031
- Published applications
- 4,618
- Assignees
- 1,520
- Inventors
- 9,587
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 12 | 0 |
| 1977 | 9 | 0 |
| 1978 | 8 | 0 |
| 1979 | 6 | 0 |
| 1980 | 8 | 0 |
| 1981 | 18 | 0 |
| 1982 | 12 | 0 |
| 1983 | 18 | 0 |
| 1984 | 20 | 0 |
| 1985 | 22 | 0 |
| 1986 | 19 | 0 |
| 1987 | 42 | 0 |
| 1988 | 33 | 0 |
| 1989 | 43 | 0 |
| 1990 | 38 | 0 |
| 1991 | 40 | 0 |
| 1992 | 43 | 0 |
| 1993 | 38 | 0 |
| 1994 | 54 | 0 |
| 1995 | 51 | 0 |
| 1996 | 55 | 0 |
| 1997 | 52 | 0 |
| 1998 | 76 | 0 |
| 1999 | 77 | 0 |
| 2000 | 64 | 0 |
| 2001 | 101 | 39 |
| 2002 | 97 | 126 |
| 2003 | 103 | 141 |
| 2004 | 103 | 171 |
| 2005 | 93 | 252 |
| 2006 | 101 | 198 |
| 2007 | 106 | 229 |
| 2008 | 97 | 232 |
| 2009 | 120 | 284 |
| 2010 | 139 | 293 |
| 2011 | 153 | 206 |
| 2012 | 181 | 193 |
| 2013 | 152 | 161 |
| 2014 | 127 | 229 |
| 2015 | 129 | 229 |
| 2016 | 169 | 178 |
| 2017 | 155 | 167 |
| 2018 | 138 | 170 |
| 2019 | 153 | 158 |
| 2020 | 123 | 186 |
| 2021 | 132 | 143 |
| 2022 | 112 | 147 |
| 2023 | 114 | 125 |
| 2024 | 102 | 162 |
| 2025 | 107 | 113 |
| 2026 | 66 | 86 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Curable compositions29 Sep 2026US 12,747,343 B2AGC Multi Material America, Inc.
- Wiring board22 Sep 2026US 12,745,348 B2KYOCERA Corporation
- Resin composition and prepreg, film with resin, metal foil with resin, metal-clad laminated plate, and wiring board using same15 Sep 2026US 12,735,543 B2Panasonic Intellectual Property Management Co., Ltd.
- Wiring board15 Sep 2026US 12,739,972 B2KYOCERA Corporation
- Use of inorganic thin non-woven dielectrics in printed circuit boards8 Sep 2026US 12,733,093 B2Advanced Chip and Circuit Materials, Inc.
- Organic fiber fabric and uses of the same8 Oct 2026US 2026/0308839 A1
- Flexible laminate material1 Oct 2026US 2026/0295973 A1The Chemours Company Fc, LLC
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- Thermosetting resin composition, prepreg, resin film, metal-clad laminate, printed wiring board, antenna device, antenna module, and communication device24 Sep 2026US 2026/0285008 A1Resonac Corporation
- Resin composition, prepreg, laminate, resin film, printed wiring board, and semi-conductor package24 Sep 2026US 2026/0286119 A1Resonac Corporation
Most cited
By later US patents
- LED lamp assembly with means to conduct heat away from the LEDS470US 6,045,240 ARelume Corporation · 2000
- Fabric or garment with integrated flexible information infrastructure445US 6,381,482 B1Georgia Tech Research Corporation · 2002
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- Thermally protected LED array337US 5,785,418 A1998
- Electrically active textiles and articles made therefrom283US 6,210,771 B1Massachusetts Institute of Technology · 2001