Circuit forming method and circuit forming apparatus

A circuit forming apparatus comprising:

• a placing device configured to place a component at a certain position;
• a resin layer forming device configured to form a resin layer using a curable resin;
• and
• a control device, wherein
• the control device is configured to execute:
• a first component placing process of placing, by the placing device, on wiring, a first component including a conductive portion configured to conduct between an upper surface and a lower surface such that the conductive portion at the lower surface of the first component is electrically connected to the wiring;
• a resin layer forming process of forming, by the resin layer forming device, on the first component and the wiring, a resin layer including an opening through which the conductive portion at the upper surface of the first component is exposed;
• and
• a second component placing process of placing, by the placing device, on the first component, a second component including a conductive portion at least at a lower surface such that the conductive portion at the lower surface of the second component is electrically connected to the conductive portion at the upper surface of the first component exposed through the opening.