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US 12,735,543 B2Granted
Resin composition and prepreg, film with resin, metal foil with resin, metal-clad laminated plate, and wiring board using same
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsYasunori Nishiguchi, Hirosuke Saito, Taito Hieida
Life of this patent
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Abstract
A resin composition contains a preliminary reaction product (A) obtained by previously reacting a mixture containing a maleimide compound (a1) having two or more maleimide groups in a molecule and a phosphorus-containing compound (a2) that is at least one of a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide compound or a diphenylphosphine oxide compound; and a thermosetting resin (B) having two or more unsaturated double bonds.
Claims14
A resin composition comprising:
- a preliminary reaction product (A) obtained by previously reacting a mixture containing a maleimide compound (a1) having two or more maleimide groups in a molecule and a phosphorus-containing compound (a2) that is at least one of a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide compound or a diphenylphosphine oxide compound;
- and
- a thermosetting resin (B) having two or more unsaturated double bonds, wherein
- the preliminary reaction product (A) contains
- an unreacted phosphorus-containing compound (a2) and
- a phosphorus-containing compound (a2-1) obtained by preliminarily reacting the phosphorus-containing compound (a2), and
- a reaction rate of the phosphorus-containing compound (a2) is 50% or more and 100% or less as determined by peak area value of phosphorus-containing compound (a2-1)/(peak area value of (a2) component+peak area value of phosphorus-containing compound (a2-1)) in a 31P-NM chart.
4 more elements
Dependencies are inferred from the claim text.