280,311 results
PatentTitle and first matching claimMatch
- US 2026/0324513 A1Published 15 Oct 2026
- US 2026/0324487 A1Published 15 Oct 2026
- US 2026/0324474 A1Published 15 Oct 2026Embedded wafer level ball grid array packages
Huawei Technologies Co., Ltd.
- US 2026/0324229 A1Published 15 Oct 2026Display device
Semiconductor Energy Laboratory Co., Ltd.
- US 2026/0323899 A1Published 15 Oct 2026
- US 2026/0323898 A1Published 15 Oct 2026System and method for building and modifying a circuit board
David Francis Aubin, JR., Kenneth Elden Colpritt +1inventors
- US 2026/0323897 A1Published 15 Oct 2026Electronic device
Compal Electronics, Inc.
- US 2026/0323896 A1Published 15 Oct 2026Protector for an Electronic Challenge Device
Paul Smithinventor
- US 2026/0323895 A1Published 15 Oct 2026Mission Configurable Shelter with Electromagnetic Interference (EMI) Protection
HDT Expeditionary Systems, Inc.
- US 2026/0323894 A1Published 15 Oct 2026
- US 2026/0323893 A1Published 15 Oct 2026Display device and electronic device including the display device
Samsung Display Co., Ltd.
- US 2026/0323892 A1Published 15 Oct 2026Battery Disconnect Unit
LG Energy Solution, Ltd.
- US 2026/0323891 A1Published 15 Oct 2026Cooling apparatus for power module
Hyundai Motor Company
- US 2026/0323890 A1Published 15 Oct 2026Cooling system for aircraft powerplant electronics
Rtx Corporation
- US 2026/0323889 A1Published 15 Oct 2026Heat dissipation housing for ac power adapter
Delta Electronics (Shanghai) Co., Ltd.
- US 2026/0323888 A1Published 15 Oct 2026Converter for a heat pump and method for producing a converter
Viessmann Holding International GmbH
- US 2026/0323887 A1Published 15 Oct 2026Cooler for power module and method of manufacturing same
Hyundai Motor Company
- US 2026/0323886 A1Published 15 Oct 2026Cryogenic cooling systems and methods
NVIDIA Corporation
- US 2026/0323885 A1Published 15 Oct 2026Water curtain cooling device and container
Guanchao Zhao, Nan Li +1inventors
- US 2026/0323884 A1Published 15 Oct 2026Heat dissipation assembly, signal transmission device, and electronic apparatus
Dongguan Luxshare Technologies Co., Ltd
- US 2026/0323883 A1Published 15 Oct 2026Memory sub-system enclosure
Micron Technology, Inc.
- US 2026/0323882 A1Published 15 Oct 2026Heat sink structure with enclosure and graphite sheet and printed ciruit board assembly including the same
Hanwha Solutions Corporation
- US 2026/0323881 A1Published 15 Oct 2026Near-unity-emissivity thermal radiator
City University of Hong Kong
- US 2026/0323880 A1Published 15 Oct 2026
- US 2026/0323879 A1Published 15 Oct 2026Pluggable electronic module with a release structure
Mellanox Technologies, Ltd.