Wiring board
AssigneeKYOCERA Corporation
InventorHidetoshi Yugawa
Life of this patent
Estimating the term…
Abstract
A wiring board according to the present disclosure includes a first insulation layer in which first insulating fillers are dispersed, and a second insulation layer located on an upper surface of the first insulation layer. The first insulation layer includes a protruding filler located protruding from the upper surface of the first insulation layer among the first insulating fillers and a coating film covering a part or all of a protruding surface of the protruding filler. The coating film has a structure in which a tin layer and a silane coupling agent layer are layered in this order. The second insulation layer covers the upper surface of the first insulation layer including the coating film.
Claims9
A wiring board comprising:
- a first insulation layer in which a plurality of first insulating fillers are dispersed in the first insulating layer;
- and
- a second insulation layer located on an upper surface of the first insulation layer, wherein
- the first insulation layer comprises a protruding filler among the plurality of first insulating fillers, the protruding filler located protruding from the upper surface of the first insulation layer, and a coating film covering a part or all of a protruding surface of the protruding filler,
- the coating film has a structure in which a tin layer and a silane coupling agent layer are layered in this order from the surface of the protruding filler, and
- the second insulation layer covers the upper surface of the first insulation layer comprising the coating film.
A wiring board comprising:
- a first insulation layer in which a plurality of first insulating fillers are dispersed in the first insulating layer;
- and
- a second insulation layer located on an upper surface of the first insulation layer, wherein
- the first insulation layer comprises a protruding filler among the plurality of first insulating fillers, the protruding filler located protruding from the upper surface of the first insulation layer, and a coating film covering a part or all of a protruding surface of the protruding filler,
- the coating film has a structure in which a tin layer and a silane coupling agent layer are layered in this order from the surface of the protruding filler,
- the second insulation layer covers the upper surface of the first insulation layer comprising the coating film,
- the coating film is also located on a part of the upper surface of the first insulation layer other than the protruding filler, and
- the coating film located on the part of the upper surface of the first insulation layer other than the protruding filler has a structure in which the tin layer and the silane coupling agent layer are layered in this order from the upper surface of the first insulation layer.
Dependencies are inferred from the claim text.