H10W
Generic packages, interconnections, connectors or other constructional details of devices covered by
Official title: Generic packages, interconnections, connectors or other constructional details of devices covered by class h10
H10W (Generic packages, interconnections, connectors or other constructional details of devices covered by) appears on 231,348 US grants and 252,482 published applications in this corpus.
Search patents in H10W- Granted patents
- 231,348
- Published applications
- 252,482
- Assignees
- 15,937
- Inventors
- 200,345
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 374 | 0 |
| 1977 | 371 | 0 |
| 1978 | 335 | 0 |
| 1979 | 241 | 0 |
| 1980 | 320 | 0 |
| 1981 | 340 | 0 |
| 1982 | 322 | 0 |
| 1983 | 356 | 0 |
| 1984 | 430 | 0 |
| 1985 | 551 | 0 |
| 1986 | 591 | 0 |
| 1987 | 744 | 0 |
| 1988 | 701 | 0 |
| 1989 | 974 | 0 |
| 1990 | 1069 | 0 |
| 1991 | 1326 | 0 |
| 1992 | 1399 | 0 |
| 1993 | 1478 | 0 |
| 1994 | 1770 | 0 |
| 1995 | 1751 | 0 |
| 1996 | 1828 | 0 |
| 1997 | 2038 | 0 |
| 1998 | 2902 | 0 |
| 1999 | 3669 | 0 |
| 2000 | 4401 | 0 |
| 2001 | 5460 | 2295 |
| 2002 | 5847 | 6411 |
| 2003 | 5898 | 6565 |
| 2004 | 5888 | 7657 |
| 2005 | 5215 | 8653 |
| 2006 | 5624 | 8491 |
| 2007 | 5388 | 8827 |
| 2008 | 4918 | 9063 |
| 2009 | 5281 | 8731 |
| 2010 | 7008 | 8309 |
| 2011 | 7044 | 8171 |
| 2012 | 6858 | 8537 |
| 2013 | 7556 | 8880 |
| 2014 | 8478 | 9810 |
| 2015 | 9017 | 10550 |
| 2016 | 9749 | 10010 |
| 2017 | 10222 | 10426 |
| 2018 | 9532 | 10449 |
| 2019 | 10409 | 11460 |
| 2020 | 10547 | 12665 |
| 2021 | 9706 | 12397 |
| 2022 | 9344 | 13138 |
| 2023 | 9216 | 13504 |
| 2024 | 9748 | 14569 |
| 2025 | 10065 | 13725 |
| 2026 | 7049 | 9189 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Main groups
Granted patents with any code in the group
- H10W 90/00Package configurations99,954
- H10W 72/00Interconnections or connectors in packages98,445
- H10W 20/00Interconnections in chips, wafers or substrates75,009
- H10W 70/00Package substrates64,920
- H10W 74/00Encapsulations57,134
- H10W 40/00Arrangements for thermal protection or thermal control27,170
- H10W 10/00Isolation regions in semiconductor bodies between components of integrated devices21,373
- H10W 42/00Arrangements for protection of devices17,642
All 17 main groupsShow fewer
- H10W 44/00Electrical arrangements for controlling or matching impedance11,052
- H10W 76/00Containers9,415
- H10W 46/00Marks applied to devices7,004
- H10W 99/00Subject matter not provided for in other groups of this subclass6,695
- H10W 80/00Direct bonding of chips, wafers or substrates4,937
- H10W 95/00Packaging processes not covered by the other groups of this subclass2,031
- H10W 78/00Detachable holders for supporting packaged chips in operation557
- H10W 15/00Highly-doped buried regions of integrated devices547
- H10W 29/00Generic parts of integrated devices, not otherwise provided for46
Recent patents
- Bonding head and bonding apparatus6 Oct 2026US 12,752,380 B2Pac Tech—Packaging Technologies GmbH
- Method for controlling a charging device6 Oct 2026US 12,752,653 B2Dr. Ing. h,c.F. Porsche Aktiengesellschaft
- Composition and method for treating substrate6 Oct 2026US 12,753,342 B2FUJIFILM Corporation
- Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and methods for electrically testing and protecting the integrated circuit6 Oct 2026US 12,753,493 B2STMicroelectronics S,r.l.
- Integrated circuit package and method of manufacturing the same6 Oct 2026US 12,754,862 B2SK hynix Inc.
- Interconnect structure and method of forming same8 Oct 2026US 2026/0306859 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Production method for boron nitride particles, production method for resin composition, and uses therefor8 Oct 2026US 2026/0307992 A1Resonac Corporation
- Semiconductor package manufacturing methods using hybrid die bonding with spin-on siloxane materials8 Oct 2026US 2026/0308432 A1
- Current sensor and manufacturing method of current sensor8 Oct 2026US 2026/0309753 A1Asahi Kasei Microdevices Corporation
- Semiconductor devices configured for repairing defective bumps8 Oct 2026US 2026/0309777 A1SK hynix Inc.
Most cited
By later US patents
- Method of spacer patterning to form a target integrated circuit pattern3,272US 9,576,814 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Analyte monitoring device and methods of use2,634US 6,175,752 B1TheraSense, Inc. · 2001
- Multicolor organic light emitting devices2,173US 5,707,745 AThe Trustees of Princeton University · 1998
- Analyte monitoring device and methods of use2,053US 6,565,509 B1TheraSense, Inc. · 2003
- Large scale photolithographic solid phase synthesis of polypeptides and receptor binding screening thereof1,998US 5,143,854 AAffymax Technologies N.V. · 1992