H10W 20/00
Interconnections in chips, wafers or substrates
H10W20/00 (Interconnections in chips, wafers or substrates) appears on 75,009 US grants and 79,384 published applications in this corpus.
Search patents in H10W- Granted patents
- 75,009
- Published applications
- 79,384
- Assignees
- 4,426
- Inventors
- 66,749
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 89 | 0 |
| 1977 | 73 | 0 |
| 1978 | 91 | 0 |
| 1979 | 62 | 0 |
| 1980 | 87 | 0 |
| 1981 | 84 | 0 |
| 1982 | 95 | 0 |
| 1983 | 84 | 0 |
| 1984 | 125 | 0 |
| 1985 | 150 | 0 |
| 1986 | 132 | 0 |
| 1987 | 182 | 0 |
| 1988 | 168 | 0 |
| 1989 | 261 | 0 |
| 1990 | 295 | 0 |
| 1991 | 330 | 0 |
| 1992 | 357 | 0 |
| 1993 | 416 | 0 |
| 1994 | 461 | 0 |
| 1995 | 466 | 0 |
| 1996 | 491 | 0 |
| 1997 | 589 | 0 |
| 1998 | 755 | 0 |
| 1999 | 1105 | 0 |
| 2000 | 1575 | 0 |
| 2001 | 1960 | 760 |
| 2002 | 2098 | 2156 |
| 2003 | 1957 | 2078 |
| 2004 | 1943 | 2408 |
| 2005 | 1667 | 2644 |
| 2006 | 1723 | 2511 |
| 2007 | 1599 | 2426 |
| 2008 | 1498 | 2509 |
| 2009 | 1560 | 2219 |
| 2010 | 1991 | 2154 |
| 2011 | 1975 | 2087 |
| 2012 | 1896 | 2374 |
| 2013 | 2299 | 2456 |
| 2014 | 2584 | 3006 |
| 2015 | 2896 | 3533 |
| 2016 | 3505 | 3398 |
| 2017 | 3754 | 3675 |
| 2018 | 3445 | 3482 |
| 2019 | 3584 | 3879 |
| 2020 | 3774 | 4454 |
| 2021 | 3435 | 4198 |
| 2022 | 3126 | 4386 |
| 2023 | 3164 | 4551 |
| 2024 | 3408 | 4733 |
| 2025 | 3457 | 4579 |
| 2026 | 2188 | 2728 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Composition and method for treating substrate6 Oct 2026US 12,753,342 B2FUJIFILM Corporation
- Integrated circuit package and method of manufacturing the same6 Oct 2026US 12,754,862 B2SK hynix Inc.
- Semiconductor device layout6 Oct 2026US 12,755,079 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Half-bridge circuit using monolithic flip-chip GAN power devices6 Oct 2026US 12,756,203 B2Navitas Semiconductor Limited
- Vertical transistors with backside power delivery6 Oct 2026US 12,757,371 B2Apple Inc.
- Interconnect structure and method of forming same8 Oct 2026US 2026/0306859 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Heterogeneous packaging integration of photonic and electronic elements8 Oct 2026US 2026/0309942 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor devices and methods of formation8 Oct 2026US 2026/0310095 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Memory device8 Oct 2026US 2026/0311751 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Ternary content-addressable memory cells and methods for forming the same8 Oct 2026US 2026/0311760 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method of spacer patterning to form a target integrated circuit pattern3,272US 9,576,814 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Contact structure of semiconductor device1,648US 9,105,490 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Three dimensional structure memory1,560US 5,915,167 AElm Technology Corporation · 1999
- Contact plugs in SRAM cells and the method of forming the same1,465US 9,236,300 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Contact structure of semiconductor device1,334US 8,823,065 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014