484,918 results
PatentTitle and first matching claimMatch
- US 2026/0324525 A1Published 15 Oct 2026Electrical component package with component-accommodating cavity
Microchip Technology Incorporated
- US 2026/0324524 A1Published 15 Oct 2026Sensor system and image forming apparatus
Canon Kabushiki Kaisha
- US 2026/0324523 A1Published 15 Oct 2026Semiconductor package including support wire
Samsung Electronics Co., Ltd.
- US 2026/0324522 A1Published 15 Oct 2026Hybrid recess depth substrate structure
QUALCOMM Incorporated
- US 2026/0324521 A1Published 15 Oct 2026Semiconductor package with bridge clip
John Carlo C. MOLINA, Jason B. COLTE +1inventors
- US 2026/0324520 A1Published 15 Oct 2026
- US 2026/0324519 A1Published 15 Oct 2026Semiconductor device
Fuji Electric Co., Ltd.
- US 2026/0324518 A1Published 15 Oct 2026Modular interconnection device and a method for forming the same
JCET STATS ChipPAC Korea Limited
- US 2026/0324517 A1Published 15 Oct 2026
- US 2026/0324516 A1Published 15 Oct 2026Thermal via interposer substrate
QUALCOMM Incorporated
- US 2026/0324515 A1Published 15 Oct 2026Three-dimensional semiconductor memory device with overlapping contacts, and electronic system including the same
Samsung Electronics Co., Ltd.
- US 2026/0324514 A1Published 15 Oct 2026Electronic Package With Components Mounted at two Sides of a Layer Stack
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- US 2026/0324513 A1Published 15 Oct 2026
- US 2026/0324512 A1Published 15 Oct 2026Microelectronic assemblies with communication networks
Intel Foundry IP LLC
- US 2026/0324511 A1Published 15 Oct 2026Hybrid-bonding stack including a processor die and multi-cache-level memory dies and methods of forming the same
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324510 A1Published 15 Oct 2026Semiconductor packages with signal integration and the methods of manufacturing the same
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324509 A1Published 15 Oct 2026Integrated circuit packages and methods of forming the same
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324508 A1Published 15 Oct 2026Integrated circuit packages with hybrid bonded dies and methods of manufacturing the same
Omkar Karhade, Nitin Deshpande +1inventors
- US 2026/0324507 A1Published 15 Oct 2026
- US 2026/0324506 A1Published 15 Oct 2026
- US 2026/0324505 A1Published 15 Oct 2026Micro semiconductor chip transfer substrate and method of manufacturing display apparatus
Samsung Electronics Co., Ltd.
- US 2026/0324503 A1Published 15 Oct 2026Semiconductor package having semiconductor blocks surrounding semiconductor device
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324502 A1Published 15 Oct 2026
- US 2026/0324501 A1Published 15 Oct 2026Semiconductor device and method for fabricating the same
United Microelectronics Corp.
- US 2026/0324500 A1Published 15 Oct 2026Chip stacking structure and method of fabricating the same
Taiwan Semiconductor Manufacturing Company, Ltd.