H10W 20/01
Manufacture or treatment
Official title: {Manufacture or treatment}
H10W20/01 (Manufacture or treatment) appears on 50,059 US grants and 51,846 published applications in this corpus.
Search patents in H10W- Granted patents
- 50,059
- Published applications
- 51,846
- Assignees
- 3,088
- Inventors
- 45,144
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 15 | 0 |
| 1977 | 36 | 0 |
| 1978 | 52 | 0 |
| 1979 | 31 | 0 |
| 1980 | 42 | 0 |
| 1981 | 46 | 0 |
| 1982 | 63 | 0 |
| 1983 | 48 | 0 |
| 1984 | 75 | 0 |
| 1985 | 83 | 0 |
| 1986 | 76 | 0 |
| 1987 | 105 | 0 |
| 1988 | 101 | 0 |
| 1989 | 160 | 0 |
| 1990 | 184 | 0 |
| 1991 | 180 | 0 |
| 1992 | 211 | 0 |
| 1993 | 290 | 0 |
| 1994 | 304 | 0 |
| 1995 | 318 | 0 |
| 1996 | 303 | 0 |
| 1997 | 384 | 0 |
| 1998 | 522 | 0 |
| 1999 | 847 | 0 |
| 2000 | 1277 | 0 |
| 2001 | 1607 | 602 |
| 2002 | 1645 | 1688 |
| 2003 | 1489 | 1547 |
| 2004 | 1484 | 1859 |
| 2005 | 1250 | 1991 |
| 2006 | 1289 | 1891 |
| 2007 | 1195 | 1778 |
| 2008 | 1100 | 1815 |
| 2009 | 1132 | 1524 |
| 2010 | 1407 | 1413 |
| 2011 | 1331 | 1379 |
| 2012 | 1227 | 1578 |
| 2013 | 1508 | 1649 |
| 2014 | 1747 | 1977 |
| 2015 | 1917 | 2393 |
| 2016 | 2314 | 2171 |
| 2017 | 2412 | 2231 |
| 2018 | 2118 | 2221 |
| 2019 | 2272 | 2434 |
| 2020 | 2388 | 2781 |
| 2021 | 2164 | 2644 |
| 2022 | 1958 | 2849 |
| 2023 | 1938 | 2756 |
| 2024 | 2133 | 2753 |
| 2025 | 2083 | 2554 |
| 2026 | 1198 | 1368 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Calabash-shaped MIM capacitor structure and fabricating method of the same6 Oct 2026US 12,757,418 B2United Microelectronics Corp.
- Method of fabricating transistors with implanting dopants at first and second dosages in the collector region to form the base region6 Oct 2026US 12,757,420 B2Texas Instruments Incorporated
- Semiconductor device with embedded sigma-shaped structure6 Oct 2026US 12,757,431 B2Nanya Technology Corporation
- Backside power distribution network and signal line integration6 Oct 2026US 12,757,444 B2International Business Machines Corporation
- Electrostatic discharge path for preventing plasma-induced damage during patterning of phase change material and method for forming the same6 Oct 2026US 12,757,643 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Interconnect structure and method of forming same8 Oct 2026US 2026/0306859 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor devices and methods of formation8 Oct 2026US 2026/0310095 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Apparatus and method for repairing defect of semiconductor8 Oct 2026US 2026/0311964 A1Tokyo Electron Limited
- Semiconductor devices and methods of fabricating the same8 Oct 2026US 2026/0313865 A1Samsung Electronics Co., Ltd.
- FINFET Devices with Backside Power Rail and Backside Self-Aligned Via8 Oct 2026US 2026/0313945 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method of spacer patterning to form a target integrated circuit pattern3,272US 9,576,814 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Contact structure of semiconductor device1,648US 9,105,490 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Contact plugs in SRAM cells and the method of forming the same1,465US 9,236,300 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Contact structure of semiconductor device1,334US 8,823,065 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Atomic layer deposition with nitrate containing precursors1,176US 6,203,613 B1International Business Machines Corporation · 2001