H10W 20/071
Of dielectric parts thereof
Official title: {of dielectric parts thereof}
H10W20/071 (Of dielectric parts thereof) appears on 25,780 US grants and 26,976 published applications in this corpus.
Search patents in H10W- Granted patents
- 25,780
- Published applications
- 26,976
- Assignees
- 1,570
- Inventors
- 25,266
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 4 | 0 |
| 1981 | 6 | 0 |
| 1982 | 12 | 0 |
| 1983 | 5 | 0 |
| 1984 | 14 | 0 |
| 1985 | 20 | 0 |
| 1986 | 19 | 0 |
| 1987 | 22 | 0 |
| 1988 | 15 | 0 |
| 1989 | 38 | 0 |
| 1990 | 38 | 0 |
| 1991 | 50 | 0 |
| 1992 | 65 | 0 |
| 1993 | 99 | 0 |
| 1994 | 115 | 0 |
| 1995 | 120 | 0 |
| 1996 | 103 | 0 |
| 1997 | 141 | 0 |
| 1998 | 222 | 0 |
| 1999 | 375 | 0 |
| 2000 | 616 | 0 |
| 2001 | 774 | 311 |
| 2002 | 832 | 844 |
| 2003 | 763 | 779 |
| 2004 | 771 | 938 |
| 2005 | 598 | 992 |
| 2006 | 689 | 980 |
| 2007 | 641 | 955 |
| 2008 | 586 | 953 |
| 2009 | 593 | 783 |
| 2010 | 729 | 655 |
| 2011 | 679 | 624 |
| 2012 | 580 | 697 |
| 2013 | 679 | 714 |
| 2014 | 805 | 920 |
| 2015 | 907 | 1162 |
| 2016 | 1190 | 1177 |
| 2017 | 1318 | 1224 |
| 2018 | 1176 | 1245 |
| 2019 | 1274 | 1374 |
| 2020 | 1451 | 1731 |
| 2021 | 1293 | 1596 |
| 2022 | 1232 | 1647 |
| 2023 | 1115 | 1471 |
| 2024 | 1220 | 1376 |
| 2025 | 1154 | 1219 |
| 2026 | 619 | 609 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 20/081By forming openings in the dielectric parts17,262
- H10W 20/074Of dielectric parts comprising thin functional dielectric layers10,839
- H10W 20/072Of dielectric parts comprising air gaps3,121
- H10W 20/093By modifying materials of the dielectric parts3,106
- H10W 20/092By smoothing the dielectric parts1,246
- H10W 20/098By filling between adjacent conductive parts1,123
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Most cited
By later US patents
- Method of spacer patterning to form a target integrated circuit pattern3,272US 9,576,814 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
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- Contact structure of semiconductor device1,334US 8,823,065 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Method for depositing an amorphous carbon layer1,124US 6,573,030 B1APPLIED Materials.Inc. · 2003