H10W 20/081
By forming openings in the dielectric parts
Official title: {by forming openings in the dielectric parts}
H10W20/081 (By forming openings in the dielectric parts) appears on 17,262 US grants and 18,175 published applications in this corpus.
Search patents in H10W- Granted patents
- 17,262
- Published applications
- 18,175
- Assignees
- 1,181
- Inventors
- 18,499
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 7 | 0 |
| 1983 | 2 | 0 |
| 1984 | 9 | 0 |
| 1985 | 10 | 0 |
| 1986 | 5 | 0 |
| 1987 | 9 | 0 |
| 1988 | 10 | 0 |
| 1989 | 20 | 0 |
| 1990 | 22 | 0 |
| 1991 | 29 | 0 |
| 1992 | 33 | 0 |
| 1993 | 59 | 0 |
| 1994 | 63 | 0 |
| 1995 | 63 | 0 |
| 1996 | 41 | 0 |
| 1997 | 69 | 0 |
| 1998 | 109 | 0 |
| 1999 | 230 | 0 |
| 2000 | 378 | 0 |
| 2001 | 485 | 205 |
| 2002 | 548 | 559 |
| 2003 | 495 | 560 |
| 2004 | 532 | 639 |
| 2005 | 407 | 663 |
| 2006 | 453 | 617 |
| 2007 | 427 | 633 |
| 2008 | 387 | 552 |
| 2009 | 380 | 488 |
| 2010 | 451 | 411 |
| 2011 | 412 | 398 |
| 2012 | 370 | 430 |
| 2013 | 425 | 481 |
| 2014 | 531 | 600 |
| 2015 | 596 | 832 |
| 2016 | 873 | 847 |
| 2017 | 983 | 889 |
| 2018 | 859 | 932 |
| 2019 | 946 | 993 |
| 2020 | 1005 | 1172 |
| 2021 | 901 | 1121 |
| 2022 | 854 | 1124 |
| 2023 | 737 | 962 |
| 2024 | 835 | 927 |
| 2025 | 777 | 767 |
| 2026 | 411 | 373 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 20/084For dual-damascene structures5,116
- H10W 20/089Using processes for implementing desired shapes or dispositions of the openings4,578
- H10W 20/083The openings being via holes penetrating underlying conductors2,596
- H10W 20/082The openings being tapered via holes1,899
- H10W 20/091By printing or stamping100
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