H10W 20/091
By printing or stamping
Official title: {by printing or stamping}
H10W20/091 (By printing or stamping) appears on 100 US grants and 121 published applications in this corpus.
Search patents in H10W- Granted patents
- 100
- Published applications
- 121
- Assignees
- 61
- Inventors
- 227
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 2 |
| 2004 | 2 | 8 |
| 2005 | 2 | 9 |
| 2006 | 6 | 8 |
| 2007 | 5 | 6 |
| 2008 | 6 | 9 |
| 2009 | 4 | 6 |
| 2010 | 4 | 4 |
| 2011 | 9 | 7 |
| 2012 | 4 | 7 |
| 2013 | 4 | 1 |
| 2014 | 3 | 7 |
| 2015 | 6 | 1 |
| 2016 | 5 | 4 |
| 2017 | 6 | 7 |
| 2018 | 3 | 4 |
| 2019 | 4 | 1 |
| 2020 | 2 | 7 |
| 2021 | 2 | 4 |
| 2022 | 6 | 9 |
| 2023 | 2 | 5 |
| 2024 | 3 | 1 |
| 2025 | 6 | 2 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Composition, pattern forming method, semiconductor device, and method for manufacturing semiconductor device31 Mar 2026US 12,590,173 B2Kioxia Corporation
- Method of manufacturing semiconductor device using different types of plating films23 Dec 2025US 12,506,016 B2Renesas Electronics Corporation
- Printing components to substrate posts with gaps9 Dec 2025US 12,494,367 B2X-Celeprint Limited
- Device for manufacturing side line, method of manufacturing side line and method of manufacturing display device29 Jul 2025US 12,376,274 B2LG Display Co., Ltd.
- Method for manufacturing electronic component device27 May 2025US 12,315,760 B2Resonac Corporation
- Manufacturing method for semiconductor device18 Jun 2026US 2026/0173787 A1Canon Kabushiki Kaisha
- Method for processing insulation layer, method for producing redistribution layer, and processing apparatus11 Jun 2026US 2026/0165150 A1Panasonic Intellectual Property Management Co., Ltd.
- Device for manufacturing side line, method of manufacturing side line and method of manufacturing display device23 Oct 2025US 2025/0331143 A1LG Display Co., Ltd.
- Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring board23 Jan 2025US 2025/0031315 A1Dai Nippon Printing Co.Ltd.
- Reflective mask for extreme ultraviolet lithography and a method of fabricating a semiconductor device using the same4 Jul 2024US 2024/0219824 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Fabrication of finely featured devices by liquid embossing381US 6,517,995 B1Massachusetts Institute of Technology · 2003
- Methods of forming channels and vias in insulating layers187US 5,173,442 AMicroelectronics and Computer Technology Corporation · 1992
- Trenching techniques for forming vias and channels in multilayer electrical interconnects113US 5,091,339 AMicroelectronics and Computer Technology Corporation · 1992
- Method of forming stepped structures employing imprint lithography95US 7,396,475 B2Molecular Imprints, Inc. · 2008
- Method of producing a contact structure87US 6,218,203 B1Advantest Corporation · 2001