Method for manufacturing electronic component device
AssigneeResonac Corporation
InventorsTomoaki Shibata, Tsuyoshi Ogawa, Xinrong Li
Life of this patent
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Abstract
Disclosed is a method for manufacturing an electronic component including: forming a via hole extending in a thickness direction of a curable sealing resin layer provided on a base material by an imprint method of pressing a mold into the sealing resin layer from a side opposite to the base material; curing the sealing resin layer; filling the via hole with a conductor precursor; and forming a conductive via by heating the conductor precursor filled in the via hole.
Claims10
A method for manufacturing an electronic component device, the method comprising:
- forming a via hole extending in a thickness direction of a curable sealing resin layer provided on a base material by an imprint method of pressing a mold into the sealing resin layer from a side opposite to the base material, wherein a semiconductor element is provided on the base material, and the semiconductor element is sealed by the sealing resin layer;
- curing the sealing resin layer;
- filling the via hole with a conductor precursor;
- and
- forming a conductive via by heating the conductor precursor filled in the via hole, wherein the via hole has a depth of 30 to 500 μm.
A method for manufacturing an electronic component device, the method comprising:
- forming a via hole extending in a thickness direction of a curable sealing resin layer provided on a base material by an imprint method of pressing a mold into the sealing resin layer from a side opposite to the base material, wherein a semiconductor element is provided on the base material, and the semiconductor element is sealed by the sealing resin layer;
- curing the sealing resin layer;
- filling the via hole with a conductor precursor, wherein the conductor precursor comprises a plurality of metallic particles and an organic binder in which the plurality of metallic particles are dispersed;
- and
- forming a conductive via by heating the conductor precursor filled in the via hole, wherein the via hole has a depth of 30 to 500 μm, wherein when the conductor precursor is heated, the plurality of metallic particles form a metallic sintered body through transitional liquid phase sintering, thereby forming the conductive via comprising the metallic sintered body.
A method for manufacturing an electronic component device, the method comprising:
- forming a via hole extending in a thickness direction of a curable sealing resin layer provided on a base material by an imprint method of pressing a mold into the sealing resin layer from a side opposite to the base material;
- curing the sealing resin layer;
- filling the via hole with a conductor precursor, wherein the conductor precursor comprises a plurality of metallic particles and an organic binder in which the plurality of metallic particles are dispersed, and the organic binder comprises a thermoplastic resin having a polyoxyalkylene group or a polysiloxane group;
- and
- forming a conductive via by heating the conductor precursor filled in the via hole, wherein the via hole has a depth of 30 to 500 μm.
A method for manufacturing an electronic component device, the method comprising:
- forming a via hole extending in a thickness direction of a curable sealing resin layer provided on a base material by an imprint method of pressing a mold into the sealing resin layer from a side opposite to the base material;
- filling the via hole with a conductor precursor;
- curing the sealing resin layer, wherein the sealing resin layer is cured after filling the via hole with the conductor precursor;
- and
- forming a conductive via by heating the conductor precursor filled in the via hole, wherein the via hole has a depth of 30 to 500 μm.
Dependencies are inferred from the claim text.