H10P
Generic processes or apparatus for the manufacture or treatment of devices covered
Official title: Generic processes or apparatus for the manufacture or treatment of devices covered by class h10
H10P (Generic processes or apparatus for the manufacture or treatment of devices covered) appears on 174,061 US grants and 188,709 published applications in this corpus.
Search patents in H10P- Granted patents
- 174,061
- Published applications
- 188,709
- Assignees
- 12,725
- Inventors
- 167,229
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 445 | 0 |
| 1977 | 369 | 0 |
| 1978 | 342 | 0 |
| 1979 | 300 | 0 |
| 1980 | 338 | 0 |
| 1981 | 360 | 0 |
| 1982 | 330 | 0 |
| 1983 | 404 | 0 |
| 1984 | 452 | 0 |
| 1985 | 535 | 0 |
| 1986 | 548 | 0 |
| 1987 | 661 | 0 |
| 1988 | 620 | 0 |
| 1989 | 786 | 0 |
| 1990 | 698 | 0 |
| 1991 | 816 | 0 |
| 1992 | 949 | 0 |
| 1993 | 1156 | 0 |
| 1994 | 1267 | 0 |
| 1995 | 1200 | 0 |
| 1996 | 1102 | 0 |
| 1997 | 1355 | 0 |
| 1998 | 2006 | 0 |
| 1999 | 2849 | 0 |
| 2000 | 3536 | 0 |
| 2001 | 4340 | 1871 |
| 2002 | 4677 | 5145 |
| 2003 | 4768 | 5500 |
| 2004 | 4566 | 6139 |
| 2005 | 3894 | 6381 |
| 2006 | 4025 | 6350 |
| 2007 | 3643 | 5999 |
| 2008 | 3405 | 6316 |
| 2009 | 3543 | 6022 |
| 2010 | 4700 | 5910 |
| 2011 | 4725 | 5858 |
| 2012 | 4641 | 6059 |
| 2013 | 5222 | 6733 |
| 2014 | 6224 | 7571 |
| 2015 | 6989 | 9150 |
| 2016 | 8180 | 8838 |
| 2017 | 8500 | 8961 |
| 2018 | 7674 | 8710 |
| 2019 | 8473 | 9545 |
| 2020 | 8636 | 10213 |
| 2021 | 7641 | 9287 |
| 2022 | 6898 | 9481 |
| 2023 | 6580 | 9230 |
| 2024 | 7005 | 8998 |
| 2025 | 7141 | 8683 |
| 2026 | 4547 | 5759 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Main groups
Granted patents with any code in the group
- H10P 72/00Handling or holding of wafers, substrates or devices during manufacture or treatment56,090
- H10P 14/00Formation of materials55,651
- H10P 50/00Etching of wafers, substrates or parts of devices36,730
- H10P 95/00Generic processes or apparatus for manufacture or treatments not covered by the17,111
- H10P 74/00Testing or measuring during manufacture or treatment of wafers, substrates or devices15,536
- H10P 30/00Ion implantation into wafers, substrates or parts of devices12,933
- H10P 76/00Manufacture or treatment of masks on semiconductor bodies12,135
- H10P 90/00Preparation of wafers not covered by a single main group of this9,658
All 17 main groupsShow fewer
- H10P 70/00Cleaning of wafers, substrates or parts of devices7,863
- H10P 52/00Grinding, lapping or polishing of wafers, substrates or parts of devices7,674
- H10P 54/00Cutting or separating of wafers, substrates or parts of devices6,796
- H10P 32/00Diffusion of dopants within, into or out of wafers, substrates or parts5,284
- H10P 34/00Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of3,329
- H10P 36/00Gettering within semiconductor bodies1,399
- H10P 10/00Bonding of wafers, substrates or parts of devices1,164
- H10P 58/00Singulating wafers or substrates into multiple chips, i.e. dicing178
- H10P 56/00Debonding of wafers, substrates or parts of devices11
Recent patents
- Substrate processing system6 Oct 2026US 12,752,315 B2SCREEN Holdings Co., Ltd.
- Semiconductor arrangement and method for making6 Oct 2026US 12,752,317 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Optical thickness control during a chemical mechanical polishing process and apparatus for effecting the same6 Oct 2026US 12,752,390 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Carrier tape system and methods of making and using the same6 Oct 2026US 12,753,327 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Composition and method for treating substrate6 Oct 2026US 12,753,342 B2FUJIFILM Corporation
- Semiconductor cleaning apparatus and method8 Oct 2026US 2026/0307113 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Bowl assembly and substrate processing apparatus comprising the same8 Oct 2026US 2026/0307119 A1Samsung Electronics Co., Ltd.
- Substrate processing apparatus and substrate processing method8 Oct 2026US 2026/0307120 A1Tokyo Electron Limited
- Methods of patterning substrates8 Oct 2026US 2026/0307168 A1University of Rochester
- Semiconductor processing tool and methods of operation8 Oct 2026US 2026/0307200 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Semiconductor device and manufacturing method thereof4,349US 7,674,650 B2Semiconductor Energy Laboratory Co.Ltd. · 2010
- Semiconductor device and manufacturing method thereof4,064US 7,732,819 B2Semiconductor Energy Laboratory Co.Ltd. · 2010
- Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby3,970US 7,402,506 B2Eastman Kodak Company · 2008
- LnCuO(S,Se,Te)monocrystalline thin film, its manufacturing method, and optical device or electronic device using the monocrystalline thin film3,969US 7,323,356 B2Japan Science and Technology Agency · 2008
- Field-effect transistor and method for manufacturing the same3,966US 7,411,209 B2Canon Kabushiki Kaisha · 2008