Semiconductor cleaning apparatus and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsIan HSIEH, Che-fu CHEN
Life of this patent
Estimating the term…
Abstract
The present disclosure describes a chuck-based device and a method for cleaning a semiconductor manufacturing system. The semiconductor manufacturing system can include a chamber, a chuck housed in the chamber and configured to hold a substrate, and a control device configured to control a translational displacement and a rotation of the chuck. The chuck can include a passage extending along a periphery of the chuck and dividing the chuck into an inner portion and an outer sidewall portion, and a first multiple of openings through the outer sidewall portion of the chuck and interconnected with the passage. The passage can be configured to transport a fluid. The first multiple of openings can be configured to dispense the fluid.
Claims20
An apparatus in a chamber, comprising:
- a base structure comprising:
- a first passage dividing the base structure into an inner portion and an outer sidewall portion;
- an inlet and an outlet in the inner portion;
- and
- a gas tunnel configured to receive a liquid from the inlet and the outlet;
- a heat insulating component on the base structure and comprising a first portion on the inner portion of the base structure, a second portion on the outer sidewall portion of the base structure, and a heat generating device embedded in the first portion, wherein the first and second portions are separated by the first passage;
- a platen disposed over the heat insulating component;
- and
- a second passage extending through the heat insulating component and the platen wherein the second passage is configured to supply a decontamination fluid to a first plurality of openings.
An apparatus, comprising:
- a substrate holder comprising a platen and a heat insulating layer disposed on a base structure, wherein the heat insulating layer is disposed between the platen and the base structure;
- a first passage extending along a periphery of the base structure, a periphery of the heat insulating layer, and a periphery of the platen, wherein the first passage divides each of the platen, the heat insulating layer, and the base structure into an inner portion and an outer sidewall portion, wherein an inner portion of the heat insulating layer embeds a heat generating component;
- a first plurality of openings in sidewall surfaces of the platen, sidewall surfaces of the heat insulating layer, and sidewall surfaces of the base structure, wherein the first plurality of openings are interconnected with the first passage and are configured to flow a decontamination fluid;
- and
- a second plurality of openings in a top surface of the platen.
An apparatus, comprising:
- a substrate holder comprising a platen, a heating insulating layer, and a base structure, wherein the heat insulating layer is disposed between the platen and the base structure;
- a passage extending along a periphery of the substrate holder in a vacuum chamber configured to supply a first decontamination fluid;
- and
- a first plurality of openings in sidewall surfaces of the platen, sidewall surfaces of the heat insulating layer, and sidewall surfaces of the base structure, wherein the first plurality of openings are interconnected with the passage, and wherein the first plurality of openings are configured to supply the first decontamination fluid.
Dependencies are inferred from the claim text.