H10P 72/00
Handling or holding of wafers, substrates or devices during manufacture or treatment
Official title: Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
H10P72/00 (Handling or holding of wafers, substrates or devices during manufacture or treatment) appears on 56,090 US grants and 66,614 published applications in this corpus.
Search patents in H10P- Granted patents
- 56,090
- Published applications
- 66,614
- Assignees
- 6,354
- Inventors
- 73,852
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 72 | 0 |
| 1977 | 43 | 0 |
| 1978 | 38 | 0 |
| 1979 | 30 | 0 |
| 1980 | 45 | 0 |
| 1981 | 40 | 0 |
| 1982 | 40 | 0 |
| 1983 | 49 | 0 |
| 1984 | 69 | 0 |
| 1985 | 111 | 0 |
| 1986 | 116 | 0 |
| 1987 | 157 | 0 |
| 1988 | 194 | 0 |
| 1989 | 248 | 0 |
| 1990 | 235 | 0 |
| 1991 | 255 | 0 |
| 1992 | 337 | 0 |
| 1993 | 394 | 0 |
| 1994 | 422 | 0 |
| 1995 | 380 | 0 |
| 1996 | 381 | 0 |
| 1997 | 417 | 0 |
| 1998 | 696 | 0 |
| 1999 | 922 | 0 |
| 2000 | 1149 | 0 |
| 2001 | 1320 | 639 |
| 2002 | 1435 | 1721 |
| 2003 | 1481 | 1880 |
| 2004 | 1449 | 2086 |
| 2005 | 1275 | 2061 |
| 2006 | 1187 | 1966 |
| 2007 | 1035 | 2009 |
| 2008 | 985 | 2182 |
| 2009 | 996 | 2133 |
| 2010 | 1429 | 2028 |
| 2011 | 1559 | 1940 |
| 2012 | 1534 | 1940 |
| 2013 | 1587 | 2091 |
| 2014 | 1707 | 2185 |
| 2015 | 1803 | 2405 |
| 2016 | 1909 | 2333 |
| 2017 | 2096 | 2628 |
| 2018 | 2136 | 2941 |
| 2019 | 2642 | 3357 |
| 2020 | 2934 | 3870 |
| 2021 | 2792 | 3813 |
| 2022 | 2766 | 4002 |
| 2023 | 2808 | 4000 |
| 2024 | 3045 | 3937 |
| 2025 | 3195 | 3804 |
| 2026 | 2145 | 2663 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10P 72/04Apparatus for manufacture or treatment28,718
- H10P 72/70Handling or holding of wafers, substrates or devices during manufacture or treatment26,313
- H10P 72/06Apparatus for monitoring, sorting, marking, testing or measuring9,934
- H10P 72/30Handling or holding of wafers, substrates or devices during manufacture or treatment8,462
- H10P 72/50Handling or holding of wafers, substrates or devices during manufacture or treatment3,511
- H10P 72/10Handling or holding of wafers, substrates or devices during manufacture or treatment3,496
Recent patents
- Substrate processing system6 Oct 2026US 12,752,315 B2SCREEN Holdings Co., Ltd.
- Semiconductor arrangement and method for making6 Oct 2026US 12,752,317 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Carrier tape system and methods of making and using the same6 Oct 2026US 12,753,327 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Flow control arrangements, semiconductor processing systems having flow control arrangements, and flow control methods6 Oct 2026US 12,753,499 B2ASM IP Holding B. V.
- Substrate processing device and method for cleaning substrate processing device6 Oct 2026US 12,753,506 B2Jusung Engineering Co., Ltd.
- Semiconductor cleaning apparatus and method8 Oct 2026US 2026/0307113 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Bowl assembly and substrate processing apparatus comprising the same8 Oct 2026US 2026/0307119 A1Samsung Electronics Co., Ltd.
- Substrate processing apparatus and substrate processing method8 Oct 2026US 2026/0307120 A1Tokyo Electron Limited
- Carrying method and device for cleaning foup8 Oct 2026US 2026/0307916 A1Asia Neo Tech Industrial Co., Ltd.
- Transfer robot8 Oct 2026US 2026/0307918 A1Kabushiki Kaisha Yaskawa Denki
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Process for the production of thin semiconductor material films1,233US 5,374,564 ACommissariat A L' Energie Atomique · 1994
- Radial jaw biopsy forceps1,155US 6,024,708 ASymbiosis Corporation · 2000
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Transportation apparatus and drive mechanism1,050US 7,837,425 B2Tokyo Electron Limited · 2010