H10P 72/10

Handling or holding of wafers, substrates or devices during manufacture or treatment

Official title: using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]

H10P72/10 (Handling or holding of wafers, substrates or devices during manufacture or treatment) appears on 3,496 US grants and 3,960 published applications in this corpus.

Search patents in H10P
Granted patents
3,496
Published applications
3,960
Assignees
1,027
Inventors
7,198
Latest grant
6 Oct 2026

Filings by year

H10P 72/10: granted patents and published applications per publication year
YearGranted patentsPublished applications
197650
197740
197830
197950
198040
198120
198210
198320
198440
198570
1986170
1987160
1988180
1989230
1990140
1991230
1992290
1993250
1994290
1995370
1996340
1997280
1998670
1999680
2000880
20018430
20029686
200363126
200475117
200565120
200668123
200755117
200859101
200953133
20107496
201174114
20128198
201378120
201478131
2015101160
2016109141
2017128166
2018150206
2019166215
2020200258
2021159236
2022184230
2023192273
2024213223
2025205196
2026133144

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

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