Frame cassette with internal cover cases
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorJen-Yuan Chang
Life of this patent
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Abstract
A frame cassette used for semiconductor processing is provided. The frame cassette includes: a housing; and a plurality of cover cases disposed in the housing. Each of the plurality of cover cases is capable of accommodating a frame and includes: a bottom section; a top section parallel to the bottom section; and at least one sidewall extending, in a vertical direction, between and connecting the bottom section and the top section to form an enclosed space.
Claims20
A frame cassette used for semiconductor processing comprising:
- a housing;
- a plurality of cover cases disposed in the housing, wherein each of the plurality of cover cases is capable of accommodating a frame that holds at least one die on an adhesive tape, each of the plurality of cover cases comprising:
- a bottom section;
- a top section parallel to the bottom section;
- and
- at least one sidewall extending, in a vertical direction, between and connecting the bottom section and the top section to form an enclosed space;
- a first frame vent hole serving as an inlet;
- and
- a second frame vent hole serving as an outlet.
A cover case used for semiconductor processing, the cover case comprising:
- a bottom section;
- a top section parallel to the bottom section;
- at least one sidewall extending, in a vertical direction, between and connecting the bottom section and the top section to form an enclosed space, wherein the enclosed space is operable to accommodate a frame, a plurality of top dies being disposed on an adhesive tape on the frame;
- a plurality of frame bases disposed on the bottom section;
- and
- a plurality of vent holes disposed at the top section.
A method of semiconductor processing comprising:
- transferring a first frame placed in a cover case disposed in a frame cassette to a pick-and-place tool, a plurality of top dies being disposed on the first frame, wherein the cover case is characterized by an enclosed space operable to accommodate the first frame;
- transferring a first wafer placed in a wafer container to the pick-and-place tool, a plurality of bottom dies being disposed on the first wafer and corresponding to the plurality of top dies, respectively;
- and
- bonding, by the pick-and-place tool, the plurality of top dies to the plurality of bottom dies, respectively.
Dependencies are inferred from the claim text.