363,606 results
- US 2026/0324508 A1Published 15 Oct 2026Integrated circuit packages with hybrid bonded dies and methods of manufacturing the same
Omkar Karhade, Nitin Deshpande +1inventors
- US 2026/0324507 A1Published 15 Oct 2026
- US 2026/0324500 A1Published 15 Oct 2026Chip stacking structure and method of fabricating the same
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324493 A1Published 15 Oct 2026Semiconductor device and method of manufacturing semiconductor device
Mitsubishi Electric Corporation
- US 2026/0324490 A1Published 15 Oct 2026Method for manufacturing semiconductor device, and semiconductor device
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- US 2026/0324458 A1Published 15 Oct 2026Info-pop structures with tivs having cavities
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324445 A1Published 15 Oct 2026Carbon Assisted Semiconductor Dicing And Method
ThinSiC Inc.
- US 2026/0324441 A1Published 15 Oct 2026Off-chip passive components for radio frequency integrated circuits
Space Exploration Technologies Corp.
- US 2026/0324435 A1Published 15 Oct 2026Method for Singulating Semiconductor Devices and Package Device Including the Semiconductor Devices
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324430 A1Published 15 Oct 2026Semiconductor device and method of making
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324415 A1Published 15 Oct 2026Semiconductor package including heat dissipation structure and method of manufacturing the same
Samsung Electronics Co., Ltd.
- US 2026/0324394 A1Published 15 Oct 2026Semiconductor Device With Source/Drain Via
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324379 A1Published 15 Oct 2026
- US 2026/0324376 A1Published 15 Oct 2026Shallow-trench isolation protection structure for nanostructure field-effect transistor device and methods of forming
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324374 A1Published 15 Oct 2026Methods for isolation process control and structures thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324371 A1Published 15 Oct 2026Substrate processing method and substrate processing system
Tokyo Electron Limited
- US 2026/0324370 A1Published 15 Oct 2026Line-end extension method and device
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324369 A1Published 15 Oct 2026Patterning method using secondary resist surface functionalization for mask formation
Tokyo Electron Limited
- US 2026/0324368 A1Published 15 Oct 2026Test line structure for integrated chip comprising optical devices
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0324367 A1Published 15 Oct 2026Semiconductor test structure and test method for interlayer overlay shift of metal layers
Swaysure Technology Co., Ltd.
- US 2026/0324366 A1Published 15 Oct 2026
- US 2026/0324365 A1Published 15 Oct 2026
- US 2026/0324364 A1Published 15 Oct 2026
- US 2026/0324363 A1Published 15 Oct 2026Member for semiconductor manufacturing equipment
NGK Corporation
- US 2026/0324362 A1Published 15 Oct 2026Wafer placement table
NGK Corporation