H10P 72/12
Vertical boat type carrier whereby the substrates are horizontally supported
Official title: {Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements}
H10P72/12 (Vertical boat type carrier whereby the substrates are horizontally supported) appears on 457 US grants and 589 published applications in this corpus.
Search patents in H10P- Granted patents
- 457
- Published applications
- 589
- Assignees
- 191
- Inventors
- 1,217
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 9 | 0 |
| 1997 | 5 | 0 |
| 1998 | 3 | 0 |
| 1999 | 7 | 0 |
| 2000 | 14 | 0 |
| 2001 | 10 | 3 |
| 2002 | 12 | 13 |
| 2003 | 8 | 17 |
| 2004 | 11 | 20 |
| 2005 | 6 | 12 |
| 2006 | 9 | 14 |
| 2007 | 8 | 22 |
| 2008 | 6 | 16 |
| 2009 | 4 | 17 |
| 2010 | 18 | 14 |
| 2011 | 18 | 14 |
| 2012 | 14 | 24 |
| 2013 | 6 | 14 |
| 2014 | 8 | 15 |
| 2015 | 16 | 14 |
| 2016 | 13 | 15 |
| 2017 | 12 | 26 |
| 2018 | 27 | 40 |
| 2019 | 14 | 38 |
| 2020 | 26 | 35 |
| 2021 | 23 | 36 |
| 2022 | 27 | 41 |
| 2023 | 24 | 37 |
| 2024 | 31 | 34 |
| 2025 | 40 | 32 |
| 2026 | 14 | 26 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Plasma processing apparatus and plasma processing method8 Sep 2026US 12,729,440 B2Tokyo Electron Limited
- Semiconductor manufacturing apparatus18 Aug 2026US 12,713,878 B2Samsung Electronics Co., Ltd.
- Wafer boat and plate for wafer boat4 Aug 2026US 12,701,956 B2Hanwha Solutions Corporation
- Components and apparatus for improving uniformity of an epitaxial layer16 Jun 2026US 12,660,560 B2APPLIED Materials.Inc.
- Substrate processing apparatus and substrate processing method2 Jun 2026US 12,644,186 B2Tokyo Electron Limited
- Liner for batch semiconductor processing apparatus1 Oct 2026US 2026/0297733 A1ASM IP Holding B. V.
- Batch substrate processing for area selective deposition1 Oct 2026US 2026/0305230 A1ASM IP Holding B. V.
- Wafer boat1 Oct 2026US 2026/0305235 A1ASM IP Holding B. V.
- Substrate holder, substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording medium1 Oct 2026US 2026/0305236 A1Kokusai Electric Corporation
- Vertical heat treatment device10 Sep 2026US 2026/0271654 A1Changzhou S.C Exact Equipment Co., Ltd.
Most cited
By later US patents
- Wafer holding, wafer support member, wafer boat and heat treatment furnace566US 7,204,887 B2Nippon Steel Corporation · 2007
- Heat treatment jig for semiconductor substrate555US 7,329,947 B2Sumitomo Mitsubishi Silicon Corporation · 2008
- Heat treatment apparatus551US 5,718,574 ATokyo Electron Limited · 1998
- Semiconductor manufacturing system and wafer holder for semiconductor manufacturing system532US 7,207,763 B2Terasemicon Corporation · 2007
- Heat treating apparatus526US 7,865,070 B2Hitachi Kokusai Electric Inc. · 2011