Plasma processing apparatus and plasma processing method
AssigneeTokyo Electron Limited
InventorHiroyuki Matsuura
Life of this patent
Estimating the term…
Abstract
A plasma processing apparatus includes a processing container having an opening in a sidewall, a partition wall configured to cover the opening and to define an internal space communicating with an inside of the processing container, a processing gas supply configured to supply a processing gas to the internal space, a pair of electrodes provided on outer surfaces of opposing sidewalls of the partition wall, and a shutter mechanism configured to open and close a communication hole through which the inside of the processing container communicates with the internal space.
Claims11
A plasma processing apparatus comprising:
- a processing container having an opening in a sidewall;
- a partition wall configured to cover the opening and to define an internal space communicating with an inside of the processing container;
- a processing gas supply configured to supply a processing gas to the internal space;
- a pair of electrodes provided on outer surfaces of opposing sidewalls of the partition wall;
- and
- a shutter configured to open and close a communication hole through which the inside of the processing container communicates with the internal space, wherein:
- the shutter includes a shutter plate configured to pivot about a pivot shaft,
- an upper portion of the pivot shaft is tapered, having a conical shape that narrows as the upper portion of the pivot shaft extends toward a tip, and
- the shutter further includes a guide having a retaining portion with a hollow conical shape that pivotably holds the upper portion of the pivot shaft.
A plasma processing method comprising:
- providing a plasma processing apparatus including:
- a processing container having an opening in a sidewall;
- a partition wall configured to cover the opening and to define an internal space communicating with an inside of the processing container;
- a raw material gas supply configured to supply a raw material gas to the inside of the processing container;
- a reactant gas supply configured to supply a reactant gas that reacts with the raw material gas, to the internal space;
- a pair of electrodes provided on outer surfaces of opposing sidewalls of the partition wall;
- and
- a shutter configured to open and close a communication hole through which the inside of the processing container communicates with the internal space,
- wherein the shutter includes a shutter plate configured to pivot about a pivot shaft,
- an upper portion of the pivot shaft is tapered, having a conical shape that narrows as the upper portion of the pivot shaft extends toward a tip, and
- the shutter further includes a guide having a retaining portion with a hollow conical shape that pivotably holds the upper portion of the pivot shaft;
- and
- supplying the raw material gas from the raw material gas supply in a state where the communication hole is closed by the shutter, thereby performing a plasma processing on a substrate accommodated in the processing container of the plasma processing apparatus.
Dependencies are inferred from the claim text.