H10P 72/127
Characterised by the substrate support
Official title: {characterised by the substrate support}
H10P72/127 (Characterised by the substrate support) appears on 234 US grants and 280 published applications in this corpus.
Search patents in H10P- Granted patents
- 234
- Published applications
- 280
- Assignees
- 123
- Inventors
- 680
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 9 | 0 |
| 1997 | 5 | 0 |
| 1998 | 3 | 0 |
| 1999 | 5 | 0 |
| 2000 | 7 | 0 |
| 2001 | 3 | 1 |
| 2002 | 6 | 6 |
| 2003 | 4 | 9 |
| 2004 | 5 | 11 |
| 2005 | 4 | 9 |
| 2006 | 5 | 5 |
| 2007 | 6 | 14 |
| 2008 | 6 | 6 |
| 2009 | 2 | 12 |
| 2010 | 9 | 9 |
| 2011 | 11 | 7 |
| 2012 | 8 | 19 |
| 2013 | 5 | 4 |
| 2014 | 1 | 7 |
| 2015 | 8 | 7 |
| 2016 | 8 | 8 |
| 2017 | 6 | 15 |
| 2018 | 11 | 23 |
| 2019 | 11 | 21 |
| 2020 | 12 | 12 |
| 2021 | 10 | 13 |
| 2022 | 14 | 14 |
| 2023 | 11 | 9 |
| 2024 | 11 | 13 |
| 2025 | 13 | 15 |
| 2026 | 6 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor manufacturing apparatus18 Aug 2026US 12,713,878 B2Samsung Electronics Co., Ltd.
- Wafer boat and plate for wafer boat4 Aug 2026US 12,701,956 B2Hanwha Solutions Corporation
- Wafer placement table2 Jun 2026US 12,648,396 B2NGK Insulators, Ltd.
- Substrate carrier2 Jun 2026US 12,648,471 B1Yield Engineering Systems, Inc.
- Wafer boat system, holder ring and use thereof7 Apr 2026US 12,598,943 B2ASM IP Holding B. V.
- Substrate holder, substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording medium1 Oct 2026US 2026/0305236 A1Kokusai Electric Corporation
- Wafer placement table20 Aug 2026US 2026/0247911 A1NGK Corporation
- Wafer carrier30 Jul 2026US 2026/0223628 A1ASM IP Holding B. V.
- Jig for wafer etching and wafer etching method9 Jul 2026US 2026/0198257 A1SK Siltron Co., Ltd.
- Wafer boat system, holder ring and use thereof9 Jul 2026US 2026/0198258 A1ASM IP Holding B. V.
Most cited
By later US patents
- Wafer holding, wafer support member, wafer boat and heat treatment furnace566US 7,204,887 B2Nippon Steel Corporation · 2007
- Heat treatment jig for semiconductor substrate555US 7,329,947 B2Sumitomo Mitsubishi Silicon Corporation · 2008
- Heat treatment apparatus551US 5,718,574 ATokyo Electron Limited · 1998
- Semiconductor manufacturing system and wafer holder for semiconductor manufacturing system532US 7,207,763 B2Terasemicon Corporation · 2007
- Heat treating apparatus526US 7,865,070 B2Hitachi Kokusai Electric Inc. · 2011