Semiconductor manufacturing apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsJoohoon Kim, Dongseop Lee
Life of this patent
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Abstract
A semiconductor manufacturing apparatus includes a first structure having a first hole, a second structure on the first structure, the second structure including a space for accommodating a substrate and a lower plate with a second hole, a first pin insertable into the first hole, the first pin having a same diameter as the first hole and a length smaller than a length of the first hole in a vertical direction, a second pin insertable into the second hole and on the first pin, the second pin having a same diameter as the second hole, a locking plate between the first pin and the second pin, the locking plate overhanging a side wall of the first pin, and a coupling member configured to couple the first pin to or separate the first pin from the second pin.
Claims20
A semiconductor manufacturing apparatus, comprising:
- a first structure having a first hole;
- a second structure on the first structure, the second structure including a space for accommodating a substrate and a lower plate with a second hole;
- a first pin insertable into the first hole, the first pin having a same diameter as the first hole and a length smaller than a length of the first hole in a vertical direction;
- a second pin insertable into the second hole and on the first pin, the second pin having a same diameter as the second hole;
- a locking plate between the first pin and the second pin, the locking plate overhanging a side wall of the first pin;
- and
- a coupling member configured to couple the first pin to or separate the first pin from the second pin.
A semiconductor manufacturing apparatus, comprising:
- a support including a first hole extending in a vertical direction;
- a boat on an upper surface of the support and accommodating at least one substrate, the boat including a second hole extending in the vertical direction;
- a first pin in the first hole and having a same diameter as the first hole;
- a second pin on the first pin, the second pin being in the second hole and having a same diameter as the second hole;
- a locking plate between the first pin and the second pin, the locking plate overlapping the upper surface of the support in the vertical direction;
- and
- a coupling member configured to couple the first pin to or separate the first pin from the second pin.
A semiconductor manufacturing apparatus, comprising:
- a support including a first hole extending in a vertical direction;
- a boat which including a lower plate having a second hole extending in the vertical direction, a rod extending from the lower plate in the vertical direction and having a slot for accommodating a substrate, and an upper plate on the rod and facing the lower plate;
- a first tube laterally surrounding the boat;
- a gas supply nozzle extending between a side wall of the first tube and the boat, from the outside of the first tube;
- a first pin in the first hole and having a same diameter as the first hole;
- a second pin on the first pin, the second pin being in the second hole and having a same diameter as the second hole;
- a locking plate between the first pin and the second pin, the locking plate overlapping an upper surface of the support in the vertical direction;
- a coupling member on the second pin and configured to couple the first pin to or separate the first pin from the second pin, the coupling member including a magnet;
- and
- a switch including a knob, the switch being configured to adjust the coupling member to couple the first pin to or separate the first pin from the second pin, and the switch being integrated with the second pin and the coupling member.
Dependencies are inferred from the claim text.