Wafer placement table

A wafer placement table comprising:

• a ceramic plate having a wafer placement surface at an upper surface and incorporating an electrode;
• a cooling plate having a refrigerant flow path and being provided on a lower surface-side of the ceramic plate;
• a first ceramic plate penetration section that penetrates the ceramic plate in an up-down direction and reaches the wafer placement surface;
• a second ceramic plate penetration section that penetrates the ceramic plate in the up-down direction and reaches the wafer placement surface;
• a first gas passage that is provided at least inside the cooling plate, and communicates with the first ceramic plate penetration section;
• and
• a second gas passage that is provided at least inside the cooling plate, and communicates with the second ceramic plate penetration section,
• wherein the first gas passage has a first gas intermediate passage extending in a direction intersecting the up-down direction,
• the second gas passage has a second gas intermediate passage extending in a direction intersecting the up-down direction,
• the second gas intermediate passage is provided above the first gas intermediate passage,
• the refrigerant flow path has a first flow path section provided above the first gas intermediate passage, and a second flow path section provided below the second gas intermediate passage,
• wherein a plurality of first ceramic plate penetration sections, each of which is the first ceramic plate penetration section, and a plurality of second ceramic plate penetration sections, each of which is the second ceramic plate penetration section are provided,
• the first gas intermediate passage communicates with the plurality of first ceramic plate penetration sections,
• the second gas intermediate passage communicates with the plurality of second ceramic plate penetration sections,
• the first gas passage has one or more first gas introduction passages provided to communicate with the first gas intermediate passage, the one or more first gas introduction passages being smaller in number than a number of the plurality of first ceramic plate penetration sections, and
• the second gas passage has second gas introduction passages provided to communicate with the second gas intermediate passage, the one or more second gas introduction passages being smaller in number than a number of the plurality of second ceramic plate penetration sections.