H10P 72/123
Characterised by a material, a roughness, a coating or the like
Official title: {characterised by a material, a roughness, a coating or the like}
H10P72/123 (Characterised by a material, a roughness, a coating or the like) appears on 85 US grants and 104 published applications in this corpus.
Search patents in H10P- Granted patents
- 85
- Published applications
- 104
- Assignees
- 60
- Inventors
- 200
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 6 | 0 |
| 2001 | 3 | 1 |
| 2002 | 6 | 5 |
| 2003 | 2 | 5 |
| 2004 | 2 | 7 |
| 2005 | 2 | 4 |
| 2006 | 4 | 8 |
| 2007 | 2 | 7 |
| 2008 | 1 | 5 |
| 2009 | 1 | 5 |
| 2010 | 10 | 6 |
| 2011 | 4 | 4 |
| 2012 | 4 | 1 |
| 2013 | 1 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 3 |
| 2016 | 1 | 2 |
| 2017 | 1 | 3 |
| 2018 | 6 | 1 |
| 2019 | 0 | 8 |
| 2020 | 2 | 4 |
| 2021 | 5 | 5 |
| 2022 | 3 | 1 |
| 2023 | 2 | 5 |
| 2024 | 3 | 4 |
| 2025 | 4 | 3 |
| 2026 | 2 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Components and apparatus for improving uniformity of an epitaxial layer16 Jun 2026US 12,660,560 B2APPLIED Materials.Inc.
- Semiconductor device and methods of making and using an enhanced carrier to reduce electrostatic discharge24 Mar 2026US 12,588,463 B2STATS ChipPAC Pte. Ltd.
- Substrate processing apparatus30 Sep 2025US 12,431,384 B2Tokyo Electron Limited
- Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium26 Aug 2025US 12,400,855 B2Kokusai Electric Corporation
- Processing chamber with annealing mini-environment11 Mar 2025US 12,249,522 B2APPLIED Materials.Inc.
- Wafer carrier30 Jul 2026US 2026/0223628 A1ASM IP Holding B. V.
- Jig for wafer etching and wafer etching method9 Jul 2026US 2026/0198257 A1SK Siltron Co., Ltd.
- Transmissive and absorptive mass arrangements for lift frames, and related processing chambers, chamber kits, and methods5 Mar 2026US 2026/0068586 A1APPLIED Materials.Inc.
- Systems for transporting a plurality of semiconductor structures15 Jan 2026US 2026/0018441 A1GlobalWafers Co., Ltd.
- Wafer boats and methods for heating a set of semiconductor structures15 Jan 2026US 2026/0018442 A1GlobalWafers Co., Ltd.
Most cited
By later US patents
- Heat treating apparatus526US 7,865,070 B2Hitachi Kokusai Electric Inc. · 2011
- Heat treatment jig for silicon semiconductor substrate478US 7,210,925 B2Sumitomo Mitsubishi Silicon Corporation · 2007
- Generation of compact alumina passivation layers on aluminum plasma equipment components108US 9,903,020 B2APPLIED Materials.Inc. · 2018
- Conditioned semiconductor system parts107US 9,885,117 B2APPLIED Materials.Inc. · 2018
- Wafer supporting jig and a decompressed gas phase growth method using such a jig56US 5,169,684 AToyoko Kagaku Co., Ltd. · 1992