Wafer supporting jig and a decompressed gas phase growth method using such a jig
AssigneeToyoko Kagaku Co., Ltd.
InventorYouji Takagi
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Abstract
A there is disclosed a wafer supporting jig that allows formation of a film with an even thickness on a wafer as well as a decompressed gas-phase growth method utilizing such a jig. A wafer supporting jig according to the invention is realized in the form of a ring made of a heat-resistive material having a central opening.
Claims4
A decompressed gas-phase growth method where a gas is introduced into a reaction tube containing a wafer and the reaction tube is heated from the exterior so as to grow a thin film on the wafer and a ring-shaped jig is utilized, the method comprising rigidly fitting said ring-shaped jig to a support pillar, said jig being in the general form of a ring with a central opening and being made of heat resistive material, said ring-shaped jig having a plurality of wafer supporting projections provided on an upper surface thereof for providing a space between the ring and a supported wafer, and placing a substrate wafer vis-a-vis said supporting projections of said ring-shaped jig.
Dependencies are inferred from the claim text.