Semiconductor device and methods of making and using an enhanced carrier to reduce electrostatic discharge
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsMoonSu Han, YoungJun Kim, DongChae Kim, Ilhan Jung, Cheolsoo Lee
Life of this patent
Estimating the term…
Abstract
A semiconductor device is made with a boat carrier including stainless steel. A Polytetrafluoroethylene (PTFE) layer is formed over the boat carrier. A semiconductor package substrate is disposed over the boat carrier. A manufacturing step is performed on the semiconductor package substrate. An electrostatic discharge (ESD) is imparted on the boat carrier during the manufacturing step. The semiconductor package substrate is protected from the ESD by the PTFE layer.
Claims25
A method of making a semiconductor device, comprising:
- forming a boat carrier by,
- providing a flat sheet of stainless steel, wherein a thickness of the flat sheet is selected to coincide with a desired maximum thickness of the boat carrier, and
- machining, shaping, or forming the flat sheet to include an opening through the flat sheet and a pin extending from a flange;
- forming a Polytetrafluoroethylene (PTFE) layer over the boat carrier, wherein the PTFE layer coats the surfaces of the boat carrier including the opening, the pin, and the flange, and wherein the PTFE layer is an insulating layer comprising a PTFE material without additives in the PTFE material;
- disposing a semiconductor package substrate over the boat carrier;
- and
- performing a manufacturing step on the semiconductor package substrate, wherein an electrostatic discharge (ESD) is imparted on the boat carrier during the manufacturing step, and wherein the semiconductor package substrate is protected from the ESD by the PTFE layer.
A method of making a semiconductor device, comprising:
- forming a boat carrier by,
- providing a stainless steel sheet,
- forming a first opening through the stainless steel sheet,
- forming a plurality of second openings through the stainless steel sheet around the first opening, and
- disposing a plurality of pins with each of the plurality of pins disposed in a respective one of the second openings and extending above top surface of the stainless steel sheet;
- and
- forming a Polytetrafluoroethylene (PTFE) coating over the boat carrier, wherein the PTFE coating is insulating.
A method of making a semiconductor device, comprising:
- providing a boat carrier including a conductive material;
- and
- forming an insulating coating on the boat carrier.
A semiconductor manufacturing device, comprising:
- a boat carrier including stainless steel;
- and
- a Polytetrafluoroethylene (PTFE) coating formed on the boat carrier, wherein the PTFE coating is electrically insulating.
Dependencies are inferred from the claim text.