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US 12,753,327 B2Granted
Carrier tape system and methods of making and using the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Ming Kuo, Jing Ruei Lu, Pei-Haw Tsao
Life of this patent
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Abstract
The current disclosure describes carrier tape systems, which include a carrier tape including a plurality of pockets. Each pocket contains a semiconductor device adhered to a bottom surface of the pocket by an adhesive. In some embodiments, the adhesive is a reversible adhesive. Use of the adhesive reduces the likelihood the semiconductor device will be damaged due to movement of the semiconductor device in the pocket during shipment of the carrier tape. Methods of forming a semiconductor device carrier systems and methods of supplying semiconductor devices are also described.
Claims20
A method of forming a semiconductor device carrier system comprising:
- providing a carrier tape including a plurality of pockets, each respective pocket including:
- a surface upon which a semiconductor device is supported when the semiconductor device is placed in the respective pocket;
- and
- a plurality of first sidewalls that extend transversely from the surface and define each respective pocket of the plurality of pockets;
- pre-forming a plurality of respective portions of a reversible adhesive;
- and
- after pre-forming the plurality of respective portions of reversible adhesive, coupling one or more respective portions of the plurality of respective portions of reversible adhesive to the semiconductor device;
- and
- after coupling the one or more respective portions of the plurality of respective portions of reversible adhesive to the semiconductor device, coupling the semiconductor device to a corresponding surface of a corresponding pocket of the plurality of pockets such that the one or more respective portions of the plurality of respective portions of reversible adhesive are spaced inward from corresponding first sidewalls of the plurality of first sidewalls that define the corresponding pocket of the plurality of pockets and a plurality of second sidewalls of the semiconductor device are spaced inward from the plurality of first sidewalls that define the corresponding pocket.
6 more elements
A method of forming a semiconductor device carrier system, comprising:
- forming a pocket in a carrier tape, the pocket including a bottom surface and a plurality of sidewalls that define the pocket;
- patterning a plurality of preformed pieces of reversible adhesive and coupling the plurality of preformed pieces of reversible adhesive on a semiconductor device in an array format such that respective preformed pieces of reversible adhesive of the plurality of preformed pieces of reversible adhesive are spaced apart from each other along the semiconductor device;
- after patterning the plurality of preformed pieces of the reversible adhesive, recycling a remaining portion of the reversible adhesive to form additional preformed pieces of reversible adhesive to be placed on in an additional pocket in an additional carrier tape or in another pocket in the carrier tape spaced apart from the pocket in the carrier tape;
- and
- after patterning the plurality of preformed pieces of the reversible adhesive and coupling the plurality of preformed pieces of reversible adhesive to the semiconductor device in the array format, coupling the semiconductor device to bottom surface of the pocket in the carrier tape such that the plurality of preformed pieces of reversible adhesive to the semiconductor device in the array format are spaced inward from each respective sidewalls of the plurality of sidewalls that define the pocket by placing the plurality of preformed pieces of reversible adhesive coupled to the semiconductor device into the pocket to adhere the semiconductor device to the bottom surface of the pocket to retain the semiconductor device in a position such that the semiconductor device is spaced apart from the sidewall of the pocket and the plurality of preformed pieces of reversible adhesive are spaced inward from the plurality of sidewalls that define the pocket.
2 more elements
A method, comprising:
- providing a carrier tape including:
- a surface;
- a plurality of pockets that extend downwards from the surface, each respective pocket of the plurality of pockets including:
- a end surface spaced downward relative to the surface;
- and
- a plurality of sidewalls that extend from the surface to the end surface;
- pre-forming a plurality of reversible strips of a reversible adhesive;
- after pre-forming the plurality of reversible strips of the reversible adhesive, coupling an array of the plurality of respective strips of the reversible adhesive on a semiconductor device to be adhered to a corresponding end surface of a corresponding pocket of the plurality of pockets;
- and
- after coupling the array of the of the plurality of respective portions of the reversible adhesive on the semiconductor device, coupling the semiconductor device with the array of plurality of respective portions of the reversible adhesive to the corresponding end surface of the corresponding pocket of the plurality of pockets such that the array of the plurality of respective portions of the reversible adhesive are spaced inward from the plurality of sidewalls, that define the corresponding pocket.
7 more elements
Dependencies are inferred from the claim text.