H10P 72/18
Characterised by being specially adapted for supporting a single substrate or by
Official title: {characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports}
H10P72/18 (Characterised by being specially adapted for supporting a single substrate or by) appears on 340 US grants and 404 published applications in this corpus.
Search patents in H10P- Granted patents
- 340
- Published applications
- 404
- Assignees
- 194
- Inventors
- 902
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 15 | 0 |
| 2001 | 4 | 2 |
| 2002 | 6 | 10 |
| 2003 | 5 | 10 |
| 2004 | 9 | 8 |
| 2005 | 4 | 9 |
| 2006 | 7 | 3 |
| 2007 | 5 | 6 |
| 2008 | 0 | 5 |
| 2009 | 5 | 14 |
| 2010 | 4 | 10 |
| 2011 | 4 | 7 |
| 2012 | 6 | 13 |
| 2013 | 9 | 16 |
| 2014 | 14 | 14 |
| 2015 | 12 | 21 |
| 2016 | 13 | 15 |
| 2017 | 18 | 26 |
| 2018 | 11 | 19 |
| 2019 | 20 | 28 |
| 2020 | 27 | 21 |
| 2021 | 10 | 31 |
| 2022 | 27 | 44 |
| 2023 | 29 | 24 |
| 2024 | 19 | 13 |
| 2025 | 14 | 15 |
| 2026 | 11 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Carrier for securing fabricated wafers28 Jul 2026US 12,696,718 B2Ciena Corporation
- Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component9 Jun 2026US 12,652,883 B2OSRAM Opto Semiconductors GmbH
- Method for providing a workpiece support unit for supporting a workpiece2 Jun 2026US 12,643,184 B2Disco Corporation
- Substrate sticking and breakage mitigation2 Jun 2026US 12,644,199 B2Lam Research Corporation
- Substrate carrier2 Jun 2026US 12,648,471 B1Yield Engineering Systems, Inc.
- Wafer transfer blade and assembly8 Oct 2026US 2026/0314311 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing system, storage module, and substrate processing method1 Oct 2026US 2026/0305237 A1Tokyo Electron Limited
- Substrate sticking and breakage mitigation17 Sep 2026US 2026/0275564 A1Lam Research Corporation
- Storage system for storing a plurality of substrate holders23 Jul 2026US 2026/0215216 A1Lpe S.P.A.
- Substrate processing apparatus and substrate processing system9 Jul 2026US 2026/0196451 A1Tokyo Electron Limited
Most cited
By later US patents
- Substrate supporting/transferring tray549US 7,780,440 B2Canon Anelva Corporation · 2010
- Substrate supporting/transferring tray548US 8,147,242 B2Canon Anelva Corporation · 2012
- Semiconductor manufacturing system and wafer holder for semiconductor manufacturing system532US 7,207,763 B2Terasemicon Corporation · 2007
- Method and apparatus for batch processing of wafers in a furnace511US 6,835,039 B2ASM International N.V. · 2004
- RF Coupling techniques398US 4,512,841 AInternational Business Machines Corporation · 1985