Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component
AssigneeOSRAM Opto Semiconductors GmbH
InventorsIvar Tangring, Gudrun Lindberg, Viktor Geringer, Sophia Huppmann
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Abstract
In an embodiment a method includes arranging a plurality of semiconductor chips on a carrier, arranging an auxiliary carrier on sides of the semiconductor chips facing away from the carrier, removing the carrier, separating the auxiliary carrier between the semiconductor chips to form auxiliary carrier-chip units, each of the auxiliary carrier-chip units has at least one semiconductor chip and an auxiliary carrier part adjoining the semiconductor chip, arranging each of the auxiliary carrier-chip units on a connecting carrier and removing the auxiliary carrier parts from each auxiliary carrier-chip unit.
Claims20
A method for producing an optoelectronic semiconductor component, the method comprising:
- arranging a plurality of semiconductor chips on a carrier;
- arranging an auxiliary carrier on sides of the semiconductor chips facing away from the carrier, the auxiliary carrier comprising a connecting layer;
- melting the connecting layer so that the connecting layer penetrates into spaces between the semiconductor chips;
- removing the carrier;
- separating the auxiliary carrier between the semiconductor chips to form auxiliary carrier-chip units, each of the auxiliary carrier-chip units having at least one semiconductor chip and an auxiliary carrier part adjoining the semiconductor chip;
- arranging each of the auxiliary carrier-chip units on a connecting carrier;
- and
- removing the auxiliary carrier part from each auxiliary carrier-chip unit.
A method for producing an optoelectronic semiconductor component, the method comprising:
- arranging a plurality of semiconductor chips with first main faces on a carrier, each semiconductor chip having a first main face, a second main face and side faces connecting the first main face with the second main face;
- arranging an auxiliary carrier on second main faces of the semiconductor chips facing away from the carrier, the auxiliary carrier comprising a connecting layer;
- melting the connecting layer so that the connecting layer completely covers the side faces of the semiconductor chips;
- removing the carrier;
- separating the auxiliary carrier between the semiconductor chips to form auxiliary carrier-chip units, each of the auxiliary carrier-chip units having at least one semiconductor chip and an auxiliary carrier part adjoining the semiconductor chip;
- arranging each of the auxiliary carrier-chip units on a connecting carrier;
- and
- removing the auxiliary carrier part from each auxiliary carrier-chip unit.
An optoelectronic semiconductor component comprising:
- a connector carrier;
- and
- a carrier-less semiconductor chip comprising:
- a first connector structure;
- a second connector structure;
- a dielectric layer;
- and
- a semiconductor body comprising a first semiconductor region of a first conductor type, a second semiconductor region of a second conductor type, and an active region between the first semiconductor region and the second semiconductor region, the active region being configured to emit and/or detect electromagnetic radiation,
- wherein the first connector structure is electrically conductively connected to the first semiconductor region,
- wherein the second connector structure is electrically conductively connected to the second semiconductor region,
- wherein the dielectric layer separates the first and second connector structure, is directly connected to the first and second connector structures and isolates the first connector structure from the second connector structure, and
- wherein at least one of the connector structures is in direct contact via a contact layer with the connector carrier over an entire cross-sectional area of the semiconductor body, which is parallel to a main extension direction of the semiconductor body.
Dependencies are inferred from the claim text.