Carrier for securing fabricated wafers

A method for securing a wafer in a wafer carrier, the wafer having a first side comprising a plurality of fabricated structure regions and a second side that has at least one region that is exposed for fabrication when the wafer is secured, the method comprising:

• aligning the wafer to a carrier base configured to receive the wafer based at least in part on one or more alignment features on the carrier base;
• and
• contacting the wafer to the carrier base at a plurality of support structures arranged on the carrier base, where three or more of the support structures are each
• configured to contact the first side of the wafer when the wafer is secured to the carrier base, and
• arranged on the carrier base to contact the first side of the wafer at a location on the first side of the wafer that is between at least two of the plurality of fabricated structure regions.

A method for fabricating a wafer carrier configured to secure a wafer, the wafer having a first side comprising a plurality of fabricated structure regions and a second side that has at least one region that is exposed for fabrication when the wafer is secured, the method comprising:

• forming a carrier base configured to receive the wafer, the carrier base comprising one or more alignment features for aligning the wafer to the carrier base;
• and
• forming a plurality of support structures arranged on the carrier base, where three or more of the support structures are each
• configured to contact the first side of the wafer when the wafer is secured to the carrier base, and
• arranged on the carrier base to contact the first side of the wafer at a location on the first side of the wafer that is between at least two of the plurality of fabricated structure regions.