H10P 72/30
Handling or holding of wafers, substrates or devices during manufacture or treatment
Official title: for conveying, e.g. between different workstations
H10P72/30 (Handling or holding of wafers, substrates or devices during manufacture or treatment) appears on 8,462 US grants and 9,997 published applications in this corpus.
Search patents in H10P- Granted patents
- 8,462
- Published applications
- 9,997
- Assignees
- 1,668
- Inventors
- 14,901
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 16 | 0 |
| 1977 | 6 | 0 |
| 1978 | 7 | 0 |
| 1979 | 6 | 0 |
| 1980 | 11 | 0 |
| 1981 | 9 | 0 |
| 1982 | 8 | 0 |
| 1983 | 7 | 0 |
| 1984 | 20 | 0 |
| 1985 | 27 | 0 |
| 1986 | 37 | 0 |
| 1987 | 53 | 0 |
| 1988 | 48 | 0 |
| 1989 | 53 | 0 |
| 1990 | 52 | 0 |
| 1991 | 39 | 0 |
| 1992 | 49 | 0 |
| 1993 | 71 | 0 |
| 1994 | 73 | 0 |
| 1995 | 74 | 0 |
| 1996 | 60 | 0 |
| 1997 | 83 | 0 |
| 1998 | 112 | 0 |
| 1999 | 148 | 0 |
| 2000 | 186 | 0 |
| 2001 | 197 | 115 |
| 2002 | 210 | 224 |
| 2003 | 189 | 253 |
| 2004 | 174 | 228 |
| 2005 | 134 | 218 |
| 2006 | 125 | 254 |
| 2007 | 108 | 291 |
| 2008 | 111 | 332 |
| 2009 | 103 | 282 |
| 2010 | 178 | 324 |
| 2011 | 191 | 295 |
| 2012 | 204 | 338 |
| 2013 | 226 | 352 |
| 2014 | 266 | 360 |
| 2015 | 317 | 385 |
| 2016 | 330 | 364 |
| 2017 | 290 | 363 |
| 2018 | 323 | 452 |
| 2019 | 418 | 516 |
| 2020 | 399 | 593 |
| 2021 | 427 | 551 |
| 2022 | 435 | 678 |
| 2023 | 417 | 648 |
| 2024 | 515 | 604 |
| 2025 | 537 | 589 |
| 2026 | 383 | 388 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10P 72/33Into and out of processing chamber4,373
- H10P 72/34The wafers being stored in a carrier, involving loading and unloading3,376
- H10P 72/32Between different workstations2,357
- H10P 72/36Using air tracks286
- H10P 72/38With angular orientation of workpieces63
- H10P 72/37With orientating and positioning by means of a vibratory bowl or track19
Recent patents
- Substrate processing system6 Oct 2026US 12,752,315 B2SCREEN Holdings Co., Ltd.
- Semiconductor arrangement and method for making6 Oct 2026US 12,752,317 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Apparatus for treating substrate and method for treating a substrate6 Oct 2026US 12,754,475 B2Semes Co., Ltd.
- Substrate treating apparatus and substrate treating method6 Oct 2026US 12,757,672 B2Semes Co., Ltd.
- Apparatus and methods for chemical mechanical polishing29 Sep 2026US 12,746,636 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Carrying method and device for cleaning foup8 Oct 2026US 2026/0307916 A1Asia Neo Tech Industrial Co., Ltd.
- Transfer robot8 Oct 2026US 2026/0307918 A1Kabushiki Kaisha Yaskawa Denki
- Semiconductor Thermal Processing Apparatus and Method for Transferring Workpieces by Carrier Device Thereof8 Oct 2026US 2026/0314307 A1Beijing Naura Microelectronics Equipment Co., Ltd.
- Wafer transfer blade and assembly8 Oct 2026US 2026/0314311 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Wafer container, top cover thereof, and method for managing wafer containers8 Oct 2026US 2026/0314313 A1Nanya Technology Corporation
Most cited
By later US patents
- Transportation apparatus and drive mechanism1,050US 7,837,425 B2Tokyo Electron Limited · 2010
- Multi-chamber integrated process system988US 4,951,601 AAPPLIED Materials.Inc. · 1990
- Ultra high throughput wafer vacuum processing system973US 5,855,681 AAPPLIED Materials.Inc. · 1999
- Compartnetalized substrate processing chamber732US 5,730,801 AAPPLIED Materials.Inc. · 1998
- Staged-vacuum wafer processing system and method701US 5,186,718 AAPPLIED Materials.Inc. · 1993