Apparatus for treating substrate and method for treating a substrate

A substrate treating method comprising:

• pre-treating a substrate by cleaning the substrate;
• etching the substrate by supplying an etchant and heating the substrate supplied with the etchant;
• and
• post-treating the substrate after the etching the substrate,
• wherein the pre-treating the substrate, the etching the substrate, and the post-treating the substrate are each performed in different chambers,
• the substrate on which the pre-treating the substrate is completed is transferred in a dry state to a first chamber at which the etching the substrate is performed, and
• the substrate on which the etching the substrate is completed is transferred in a wetted state with a liquid to a second chamber at which the post-treating the substrate is performed, and
• wherein the etching the substrate includes locally irradiating a laser to a specific region of the substrate in a state at which the etchant remains on the substrate to etch the specific region of the substrate.