H10P 72/38
With angular orientation of workpieces
Official title: {with angular orientation of workpieces}
H10P72/38 (With angular orientation of workpieces) appears on 63 US grants and 40 published applications in this corpus.
Search patents in H10P- Granted patents
- 63
- Published applications
- 40
- Assignees
- 60
- Inventors
- 182
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 1 |
| 2002 | 4 | 4 |
| 2003 | 4 | 4 |
| 2004 | 3 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 2 |
| 2015 | 0 | 0 |
| 2016 | 1 | 2 |
| 2017 | 2 | 1 |
| 2018 | 2 | 3 |
| 2019 | 3 | 5 |
| 2020 | 2 | 2 |
| 2021 | 2 | 3 |
| 2022 | 1 | 2 |
| 2023 | 2 | 6 |
| 2024 | 3 | 2 |
| 2025 | 1 | 1 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate processing apparatus, substrate processing method and storage medium19 May 2026US 12,635,450 B2Tokyo Electron Limited
- Substrate treating apparatus and substrate treating method using the same17 Mar 2026US 12,576,418 B2Semes Co., Ltd.
- SOT deform lead-retract removal track1 Jul 2025US 12,347,705 B2Texas Instruments Incorporated
- Wafer processing method and carrier3 Dec 2024US 12,159,794 B2Scientech Corporation
- Device for self-assembling semiconductor light-emitting diodes3 Dec 2024US 12,159,800 B2LG Electronics Inc.
- Heat reclamation multiple waste tanks at each stage10 Sep 2026US 2026/0266562 A1Tokyo Electron Limited
- Device and method with artificial intelligence-based wafer rotation30 Oct 2025US 2025/0336706 A1Samsung Electronics Co., Ltd.
- Wafer picking and placing apparatus6 Jun 2024US 2024/0186165 A1Hermes-Epitek Corporation
- Automatic Alignment Of Overhead Transport Vehicles To Load Ports Of Semiconductor Fabrication Tools21 Mar 2024US 2024/0096676 A1
- Substrate treating apparatus28 Dec 2023US 2023/0420280 A1SCREEN Holdings Co., Ltd.
Most cited
By later US patents
- Apparatus for transferring a substantially circular article389US 5,768,125 AASM International N.V. · 1998
- Mobile robot on-board vision system125US 5,219,264 ATexas Instruments Incorporated · 1993
- Wafer transfer system65US 4,634,331 AVarian Associates, Inc. · 1987
- Support device64US 5,467,720 ACanon Kabushiki Kaisha · 1995
- Dual track handling and processing system56US 4,981,408 AVarian Associates, Inc. · 1991