Wafer processing method and carrier
AssigneeScientech Corporation
InventorsChuan-Chang Feng, Mao-Lin Liu
Life of this patent
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Abstract
This disclosure provides a wafer processing method having the following steps: providing a wafer (10), an immersion device (100), a carrier (200), and a spray device (300); turning the wafer (10) from a horizontal manner to an upright manner; upright placing the wafer (10) into the immersion device (100) for immersion; taking the wafer (10) out from the immersion device (100) and placing that onto the carrier (200) horizontally; spraying a liquid on the wafer (10) by the spray device (300); rinsing the wafer (10); rotating the carrier (200) to dry the wafer (10). Multiple steps for processing the wafer (10) may be performed on the same carrier (200) to accelerate the process.
Claims11
A wafer processing method, comprising:
- a) providing a wafer (10), an immersion device (100), a carrier (200), a spray device (300) and an input arm (410);
- b) turning the wafer (10) from horizontal status to an upright status;
- c) immersing the wafer (10) in the upright status into the immersion device (100), and placing the wafer (10) into the immersion device (100) by the input arm (410);
- d) taking the wafer (10) out from the immersion device (100) and placing the wafer (10) on the carrier (200) horizontally;
- e) spraying a chemical liquid on the wafer (10) on the carrier (200) by the spray device (300) and comprising:
- e1) turning the wafer (10) into the upright status by turning the carrier (200) and placing the wafer (10) into the spray device (300);
- e2) spraying the chemical liquid to the wafer (10) in the upright manner;
- and
- e3) turning the wafer (10) into the horizontal status by turning the carrier (200);
- f) rinsing the wafer (10);
- and
- g) rotating the carrier (200) to dry the wafer (10).
Dependencies are inferred from the claim text.