Substrate treating apparatus and substrate treating method using the same

A substrate treating apparatus, comprising:

• a stage extending in a first direction and moving a substrate marked with an alignment mark along the first direction;
• a measurement unit including a camera corresponding to the alignment mark of the substrate and configured to photograph the alignment mark, on the stage;
• a first gripper configured to adsorb a first surface of the substrate and rotatable on a second direction perpendicular to the first direction;
• a second gripper configured to adsorb a second surface facing the first surface of the substrate;
• and
• a control unit configured to control the first gripper;
• wherein the camera of the measurement unit photographs the alignment mark after the first gripper adsorbs the first surface,
• the control unit configured to receive an image photographed by the camera and rotate the first gripper to align the substrate, and
• after aligning the substrate, the control unit is configured to control the second gripper to adsorb the second surface of the substrate.