SOT deform lead-retract removal track
AssigneeTexas Instruments Incorporated
InventorsSunday Hirro Rey, Sonny Baskiñas Concepcion, Daniel Mendoza Ramirez, Jr., Christian dela Cruz Montemayor
Life of this patent
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Abstract
A deform lead-retract removal track is provided which is configured to convey non-defective integrated circuit packages and remove integrated circuit packages having a lead-retract defect. The distance between the outside walls of the track is less than the distance between leads of the non-defective integrated circuit packages and greater than the distance between the leads of the integrated circuit packages having a lead-retract defect. The defective integrated circuit packages having a lead-retract defect are unable to enter the track or will become stuck on the track.
Claims20
A track configured to remove integrated circuit packages having a lead-retract defect, the track having a length and a uniform cross section provided along the length, the uniform cross section comprising:
- a base having a first end and a second end separated by a width;
- a first lead guide extending away from the base at the first end, the first lead guide having an outside wall and having an inside wall;
- and
- a second lead guide extending away from the base at the second end, the second lead guide having an outside wall and an inside wall, wherein the outside walls of the first and second lead guides prevent the integrated circuit packages having a lead-retract defect from moving across the length of the track.
A track configured to remove integrated circuit packages having a lead-retract defect, the track having a length and a uniform cross section provided along the length, the uniform cross section comprising:
- a base having a first end and a second end separated by a width,
- a first lead guide extending away from the base at the first end, the first lead guide having an outside wall and having an inside wall;
- and
- a second lead guide extending away from the base at the second end, the second lead guide having an outside wall and an inside wall, wherein the outside walls of the first and second lead guides prevent the integrated circuit packages having a lead-retract defect from moving across the length of the track, and wherein the outside walls of the first and second lead guides are angled inward.
A track configured to convey non-defective integrated circuit packages and remove integrated circuit packages having a lead-retract defect, comprising:
- the track having a length and a uniform cross section provided along the length;
- the uniform cross section formed by an extruded isosceles trapezoid having a small base and a large base, separated by a height, and two legs of equal length, the two legs forming outside walls of the track;
- the uniform cross section further formed by an extruded rectangular cut having a length equal to the length of the track, a width less than the width of the small base, and a height less than the height of the extruded isosceles trapezoid, wherein the extruded cut extends from the small base of the extruded isosceles trapezoid towards the large base to form a slot along the length of the track, and wherein a distance between the outside walls of the track is less than the distance between leads of the non-defective integrated circuit packages and greater than the distance between the leads of the integrated circuit packages having a lead-retract defect.
A method for screening integrated circuit packages having a lead-retract defect, the method comprising the steps of:
- providing a plurality of integrated circuit packages in a chip bowl;
- moving the plurality of integrated circuit packages toward an end guide of the chip bowl;
- conveying the plurality of integrated circuit packages on to a lead-retract removal track;
- and
- removing the integrated circuit packages having a lead-retract defect from the lead-retract removal track and the chip bowl,
- wherein the lead-retract removal track has a length and a uniform cross section provided along the length, wherein the lead-retract removal track is configured to convey non-defective integrated circuit packages, and wherein the integrated circuit packages having a lead-retract defect are unable to convey across the length of the lead-retract removal track.
A integrated circuit package bowl feeding system being capable of removing chip packages having a lead-retract defect, comprising:
- a chip bowl;
- and
- a track coupled to the chip bowl, the track having a cross-section spanning the distance between properly aligned leads on either side of a chip package.
Dependencies are inferred from the claim text.