H10P 72/36
Using air tracks
Official title: {using air tracks}
H10P72/36 (Using air tracks) appears on 286 US grants and 270 published applications in this corpus.
Search patents in H10P- Granted patents
- 286
- Published applications
- 270
- Assignees
- 157
- Inventors
- 571
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 6 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 9 | 0 |
| 1987 | 7 | 0 |
| 1988 | 5 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 9 | 1 |
| 2002 | 4 | 2 |
| 2003 | 1 | 3 |
| 2004 | 5 | 4 |
| 2005 | 3 | 11 |
| 2006 | 5 | 15 |
| 2007 | 4 | 10 |
| 2008 | 12 | 9 |
| 2009 | 10 | 9 |
| 2010 | 6 | 15 |
| 2011 | 9 | 15 |
| 2012 | 4 | 8 |
| 2013 | 2 | 16 |
| 2014 | 11 | 7 |
| 2015 | 5 | 11 |
| 2016 | 14 | 14 |
| 2017 | 13 | 16 |
| 2018 | 9 | 14 |
| 2019 | 15 | 19 |
| 2020 | 17 | 14 |
| 2021 | 7 | 12 |
| 2022 | 16 | 10 |
| 2023 | 9 | 13 |
| 2024 | 10 | 9 |
| 2025 | 6 | 9 |
| 2026 | 9 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Substrate transfer apparatus and substrate transfer method26 May 2026US 12,641,682 B2Tokyo Electron Limited
- Substrate transfer apparatus and substrate transfer method12 May 2026US 12,628,611 B2Tokyo Electron Limited
- Apparatus for preventing blockage of floating stage, substrate processing apparatus and substrate processing method5 May 2026US 12,616,994 B2Semes Co., Ltd.
- Purging spindle arms to prevent deposition and wafer sliding7 Apr 2026US 12,598,948 B2Lam Research Corporation
- Storage apparatus, a transfer system including the same, and a transferring method using the transfer system31 Mar 2026US 12,589,942 B2Samsung Electronics Co., Ltd.
- System and method for contactless handling of semiconductor wafers17 Sep 2026US 2026/0282824 A1PTW Asia Pte Ltd
- Substrate Transfer Apparatus and Substrate Transfer Method23 Jul 2026US 2026/0214750 A1Tokyo Electron Limited
- Transfer device for light-emitting element, display device including light-emitting element, electronic device including display device and method using transfer device12 Mar 2026US 2026/0076001 A1Samsung Display Co., Ltd.
- Wafer inspection device and wafer transport device22 Jan 2026US 2026/0026297 A1Nanosystem Solutions, Inc.
- Conveyance apparatus, conveyance method, and method for manufacturing semiconductor device11 Dec 2025US 2025/0379094 A1Jsw Aktina System Co., Ltd.
Most cited
By later US patents
- Method and apparatus for supporting a semiconductor wafer during processing442US 6,183,565 B2ASM International N.V. · 2001
- Sputter module for modular wafer processing system436US 4,670,126 AVarian Associates, Inc. · 1987
- Systems and methods for wafer handling in semiconductor process equipment395US 4,776,744 AAPPLIED Materials.Inc. · 1988
- Method for deposition of fluid and gaseous media on substrates for their transport391US 4,495,024 A1985
- Method for floating transport of substrates391US 4,575,408 A1986