H10P 72/3604
The workpieces being stored in a carrier, involving loading and unloading
Official title: {the workpieces being stored in a carrier, involving loading and unloading}
H10P72/3604 (The workpieces being stored in a carrier, involving loading and unloading) appears on 35 US grants and 26 published applications in this corpus.
Search patents in H10P- Granted patents
- 35
- Published applications
- 26
- Assignees
- 26
- Inventors
- 89
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 1 | 1 |
| 2015 | 0 | 2 |
| 2016 | 0 | 0 |
| 2017 | 2 | 4 |
| 2018 | 3 | 2 |
| 2019 | 1 | 1 |
| 2020 | 4 | 2 |
| 2021 | 2 | 2 |
| 2022 | 0 | 0 |
| 2023 | 2 | 2 |
| 2024 | 1 | 3 |
| 2025 | 0 | 4 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus for preventing blockage of floating stage, substrate processing apparatus and substrate processing method5 May 2026US 12,616,994 B2Semes Co., Ltd.
- Storage apparatus, a transfer system including the same, and a transferring method using the transfer system31 Mar 2026US 12,589,942 B2Samsung Electronics Co., Ltd.
- Nozzle and substrate processing apparatus including the same13 Jan 2026US 12,525,470 B2Semes Co., Ltd.
- System with substrate carrier deterioration detection and repair10 Dec 2024US 12,162,134 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Technique for handling diced wafers of integrated circuits23 May 2023US 11,658,056 B2NXP B. V.
- System and method for contactless handling of semiconductor wafers17 Sep 2026US 2026/0282824 A1PTW Asia Pte Ltd
- Frame unit forming method, frame unit forming apparatus, and method of forming device chips25 Sep 2025US 2025/0300003 A1Disco Corporation
- Conveyance apparatus, conveyance method, and semiconductor apparatus manufacturing method17 Jul 2025US 2025/0232996 A1Jsw Aktina System Co., Ltd.
- Automated material handling system5 Jun 2025US 2025/0183078 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate carrier deterioration detection and repair27 Mar 2025US 2025/0100161 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Sputter module for modular wafer processing system436US 4,670,126 AVarian Associates, Inc. · 1987
- Systems and methods for wafer handling in semiconductor process equipment395US 4,776,744 AAPPLIED Materials.Inc. · 1988
- Material handling system and method for manufacturing line65US 4,293,249 ATexas Instruments Incorporated · 1981
- Automatic wafer feeding and pre-alignment apparatus and method59US 3,930,684 A1976
- Indexing apparatus38US 3,945,505 AMotorola, Inc. · 1976