Technique for handling diced wafers of integrated circuits
AssigneeNXP B.V.
InventorsAntonius Hendrikus Jozef Kamphuis, Johannes Cobussen
Life of this patent
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Abstract
A technique for handling an integrated circuit tape assembly having a plurality of integrated circuits supported by underlying dicing tape involves placing the integrated circuit tape assembly on a film frame carrier (FFC) frame, stretching the dicing tape while on the FFC frame, and securing the stretched dicing tape by engaging a spring ring with the dicing tape and FFC frame. Adjacent integrated circuits are thereby inhibited from colliding during shipment or storage for subsequent processing.
Claims11
An apparatus for retaining an integrated circuit tape assembly comprising a plurality of integrated circuits supported by an underlying dicing tape, the apparatus comprising:
- a film frame carrier (FFC) frame having a central opening and an angled portion substantially surrounding the central opening;
- and
- a spring ring configured to expand when pushed into the dicing tape thereby securing the dicing tape, the angled portion of the FFC frame configured to engage an outer periphery of the spring ring to secure the dicing tape.
An apparatus for retaining an integrated circuit tape assembly comprising a plurality of integrated circuits supported by an underlying dicing tape, the apparatus comprising:
- a film frame carrier (FFC) frame having a central opening and an angled portion substantially surrounding the central opening;
- and
- a spring ring engaged with the dicing tape, the spring ring configured to expand from a compressed form when pushed into the dicing tape thereby securing the dicing tape, the angled portion of the FFC frame configured to engage an outer periphery of the spring ring to secure the dicing tape.
Dependencies are inferred from the claim text.