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US 4,670,126 AGranted
Sputter module for modular wafer processing system
AssigneeVarian Associates, Inc.
InventorsMark G. Messer, Lawrence R. Stark
Life of this patent
Estimating the term…
Abstract
A machine for sputter deposition of a wafer workpiece also sputters on the wafer supporting mechanism. This causes a need for cleaning or replacement of the support mechanism. A sputter machine is provided in which the supporting mechanism can be isolated from the sputtering source, the pumps and other processing apparatus for cleaning without exposing the entire machine to atmosphere.
Claims11
A sputter deposition module comprising:
- a first vacuum chamber and a second chamber having an opening therebetween;
- a heater located in said second chamber;
- a sputter source located in said second chamber opposite said heater;
- a first arm member in said first vacuum chamber for receiving a substrate in a horizontal orientation from a second arm extended through a port in said first vacuum chamber;
- means attached to said first arm member for rotating said first arm member and said substrate attached thereto through a first selected angle about a first axis so that said first arm member is positioned opposite said opening;
- and
- means attached to said first arm member for rotating said first arm member and said substrate attached thereto through a second selected angle about a second axis perpendicular to said first axis so that said substrate rotates through said opening and is positioned opposite said heater.
4 more elements
Dependencies are inferred from the claim text.